PCA9551PW,112 NXP Semiconductors, PCA9551PW,112 Datasheet - Page 22

• Manufacturer Part Number: PCA9551PW,112
• Description: IC LED DRIVER BLINKER 16-TSSOP
• Manufacturer: NXP Semiconductors
• Type: LED Blinkerr

Specifications of PCA9551PW,112

• Package / Case: 16-TSSOP
• Topology: Open Drain, PWM
• Number Of Outputs: 8
• Internal Driver: Yes
• Type - Primary: LED Blinker
• Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Current - Output / Channel: 25mA
• Internal Switch(s): Yes
• Low Level Output Current: 6.5 mA
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6285 - EVAL BOARD I2C-2002-1A568-4002 - DEMO BOARD I2C568-3615 - DEMO BOARD I2C
• Voltage - Output: -
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1048-5; 935271692112; PCA9551PW

NXP Semiconductors
PCA9551_8
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 14.
Table 15.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
15
26.
Rev. 08 — 31 July 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
8-bit I
2
C-bus LED driver with programmable blink rates
3
3
)
)
Figure
350 to 2000
260
250
245
26) than a SnPb process, thus
220
220
350
> 2000
260
245
245
PCA9551
© NXP B.V. 2008. All rights reserved.
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