LM5111-1MYX/NOPB National Semiconductor, LM5111-1MYX/NOPB Datasheet - Page 9
![IC MOSFET DRIVER DUAL 5A 8-MSOP](/photos/7/37/73780/pkg_muy08a_sml.jpg)
LM5111-1MYX/NOPB
Manufacturer Part Number
LM5111-1MYX/NOPB
Description
IC MOSFET DRIVER DUAL 5A 8-MSOP
Manufacturer
National Semiconductor
Datasheet
1.LM5111-1MYNOPB.pdf
(12 pages)
Specifications of LM5111-1MYX/NOPB
Configuration
Low-Side
Input Type
Non-Inverting
Delay Time
25ns
Current - Peak
5A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
3.5 V ~ 14 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Other names
LM5111-1MYX
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM5111-1MYX/NOPB
Manufacturer:
NS/TI
Quantity:
20
The schematic above shows a conceptual diagram of the
LM5111 output and MOSFET load. Q1 and Q2 are the switch-
es within the gate driver. R
external MOSFET, and C
of the MOSFET. The gate resistance Rg is usually very small
and losses in it can be neglected. The equivalent gate ca-
pacitance is a difficult parameter to measure since it is the
combination of C
(gate to drain capacitance). Both of these MOSFET capaci-
tances are not constants and vary with the gate and drain
voltage. The better way of quantifying gate capacitance is the
total gate charge Q
required by C
V
Assuming negligible gate resistance, the total power dissi-
pated in the MOSFET driver due to gate charge is approxi-
mated by
Where
F
For example, consider the MOSFET MTD6N15 whose gate
charge specified as 30 nC for V
The power dissipation in the driver due to charging and dis-
charging of MOSFET gate capacitances at switching frequen-
cy of 300 kHz and V
If both channels of the LM5111 are operating at equal fre-
quency with equivalent loads, the total losses will be twice as
this value which is 0.216W.
In addition to the above gate charge power dissipation, - tran-
sient power is dissipated in the driver during output transi-
tions. When either output of the LM5111 changes state,
current will flow from V
through the output totem-pole N and P channel MOSFETs.
The final component of power dissipation in the driver is the
power associated with the quiescent bias current consumed
by the driver input stage and Under-voltage lockout sections.
SW
GATE
= switching frequency of the MOSFET.
.
P
DRIVER
GS
P
= 12V x 30 nC x 300 kHz = 0.108W.
GS
DRIVER
and C
G
GATE
(gate to source capacitance) and C
in coloumbs. Q
CC
= V
FIGURE 2.
IN
GD
to V
of 12V is equal to
is the equivalent gate capacitance
GATE
for a given gate drive voltage
G
EE
is the gate resistance of the
for a very brief interval of time
GATE
x Q
G
= 12V.
G
x F
combines the charge
SW
20112307
GD
9
Characterization of the LM5111 provides accurate estimates
of the transient and quiescent power dissipation components.
At 300 kHz switching frequency and 30 nC load used in the
example, the transient power will be 8 mW. The 1 mA nominal
quiescent current and 12V V
typical quiescent power.
Therefore the total power dissipation
We know that the junction temperature is given by
Or the rise in temperature is given by
For SOIC-8 package θ
conditions of natural convection. For MSOP8-EP θ
cally 60°C/W.
Therefore for SOIC T
CONTINUOUS CURRENT RATING OF LM5111
The LM5111 can deliver pulsed source/sink currents of 3A
and 5A to capacitive loads. In applications requiring continu-
ous load current (resistive or inductive loads), package power
dissipation, limits the LM5111 current capability far below the
5A sink/3A source capability. Rated continuous current can
be estimated both when sourcing current to or sinking current
from the load. For example when sinking, the maximum sink
current can be calculated as:
where R
output stage of LM5111.
Consider T
package under the condition of natural convection and no air
flow. If the ambient temperature (T
of the LM5111 output at T
I
pulsed currents.
Similarly, the maximum continuous source current can be
calculated as
where V
which varies over temperature and can be assumed to be
about 1.1V at T
eters as above, this equation yields I
SINK
(max) of 391mA which is much smaller than 5A peak
DIODE
DS
(on) is the on resistance of lower MOSFET in the
P
J
(max) of 125°C and θ
D
= 0.216 + 0.008 + 0.012 = 0.236W.
is the voltage drop across hybrid output stage
J
T
(max) of 125°C. Assuming the same param-
RISE
T
RISE
T
RISE
= 0.236 x 170 = 40.1°C
J
= T
JA
= P
is equal to
J
J
(max) is 2.5Ω, this equation yields
is estimated as 170°C/W for the
D
− T
GATE
x θ
A
JA
= P
JA
A
supply produce a 12 mW
+ T
) is 60°C, and the R
of 170°C/W for an SO-8
D
SOURCE
A
x θ
JA
(max) of 347mA.
www.national.com
JA
is typi-
DS
(on)