IXBD4411PI IXYS, IXBD4411PI Datasheet - Page 9

• Manufacturer Part Number: IXBD4411PI
• Description: IC HIGH SIDE DRIVER 16DIP
• Manufacturer: IXYS
• Series: ISOSMART™r
• Type: Isolated Half Bridge Driver Chip Setr

Specifications of IXBD4411PI

• Configuration: High-Side
• Input Type: Non-Inverting
• Delay Time: 110ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 1
• High Side Voltage - Max (bootstrap): 1200V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Product: Half-Bridge Drivers
• Rise Time: 100 ns
• Fall Time: 150 ns
• Supply Voltage (min): 10 V
• Maximum Power Dissipation: 600 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Bridge Type: Half Bridge
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 1
• Output Current: 2 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

motor control. The power circuit
consists of six power switching transis-
tors with freewheeling diodes around
each of them. The control function may
be performed digitally by a microproces-
sor, microcontroller, DSP chip, or user
custom IC; or it may be performed by a
PC board full of random logic and
analog circuits. In any of these cases,
the PWM command for all six power
transistors is generated in one circuit,
and this circuit is usually referred to
system ground potential - the bottom
terminal of the power bridge.
The ISOSMART™ family of drivers is
the interface between the world of
control logic and the world of power, 5 V
input logic commands precisely control
actions at high voltage and current
(1200 V and 100 A in a typical applica-
tion). Fig. 6 is a detailed schematic of
one phase of three 3-phase motor
control, showing the interconnection of
the IXBD4410/4411 and its associated
circuitry.
© 2004 IXYS All rights reserved
with respect to KG at IM.
When the command arrives to switch
on the Power MOSFET device, the
CMOS switch shorting IM to KG is
turned off. The driven Power MOSFET
device is switched on approximately
100 ns to 1 µs later, and with typical
load conditions, its drain-to-source
potential, V
10 µs of delay to collapse to the normal
on-state voltage level. To prevent false
triggering due to this, C8 or C12 in
parallel combination with R10 and R11,
or R13 and R14, delays the IM input
signal. During this turn-on interval, the
voltage across C8 or C12 will rise until
the Power MOSFET device finally
comes on and pulls the voltage across
C8 or C12 back down. If the MOSFET
device load circuit is shorted, its V
voltage cannot collapse at turn-on. In
this case, the voltage across C8 or C12
rises rapidly until it reaches 300 mV,
tripping the fault flip-flop and shutting
down the driver output. At the same
time, C8 or C12 must be kept small
enough that the added delay does not
slow down the detection of a short
circuit event so much that the Power
MOSFET device fails before the driver
realizes that it is in trouble.
Three Phase Motor Controls
Fig. 8 is a block diagram of a typical 3-
phase PWM voltage-source inverter
DS
, may take an additional
DS
PCB Layout Considerations
The IXBD4410/4411 is intended to be
used in high voltage, high speed, high
dv/dt applications.
To ensure proper operation, great care
must be taken in laying out the printed
circuit board. The layout critical areas
include the communication links, current
sense, gate drive, and supply bypass-
ing.
The communication path should be as
short as possible. Added inductance
disturbs the frequency response of the
signal path, and these distortions may
cause false triggering in the receiver.
The transformer should be placed
between the two ICs with the orientation
of one IC reversed (Fig. 9).
Capacitance between the high- and low-
side should be minimized. No signal
trace should run underneath the
communication path, and high- and low-
side traces should be separated on the
PCB. The dv/dt of the high-side during
power stage switching may cause false
logic transitions in low-side circuits due
to capacitive coupling.
The low signal pulse transformer
provides the isolation between high-and
low-side circuits. For 460 V~ line
operation, a spacing of 4 mm is recom-
mended between low- and high-side
circuits, and a transformer HIPOT
specification of at least 1500 V~ is
required. This creep spacing is usually
adequate to control leakage currents on
the PCB with up to 1200 V~ applied
after 10 to 15 years of accumulated dust
and particulates in a standard industrial
environment. In other environments, or
at other line voltages, this spacing
should be appropriately modified.
Fig. 8: Typical 3-phase motor control system block diagram
The current sense/desaturation detect
input is noise sensitive. The 300 mV trip
point is referred to the KG (Kelvin
ground) pin, and the applied signal must
be kept as clean as possible, A filter is
recommended, preferably a monolithic
ceramic capacitor placed as close to the
IC as possible directly between IM and
KG. To preserve maximum noise
immunity, the KG pin should first be
connected directly to the LG pin, and the
pair then sent directly to the power
transistor source/emitter terminal, or (if a
desaturation detection circuit is used) to
the bottom of the divider resistor chain.
All supply pins must be bypassed with a
low impedance capacitor (preferably
monolithic ceramic construction) with
minimum lead length. The output driver
stage draws 2 A (typical) currents during
transitions at di/dt values in excess of
100 A/µs. Supply line inductance will
cause supply and ground bounce on the
chip that can cause problems (logic
oscillations and, in severe cases,
possible latch-up failure) without proper
bypassing. These bypass elements are
in addition to the reservoir capacitors
required for the negative Vee supply and
the high-side bootstrapped supply if
these features are used.
Power Circuit Noise Considerations
In a typical transistor inverter, the output
MOSFET may switch on or off with di/dt
>500 A/µs. Referring to Fig.10 and
assuming that the MOSFET source
terminal has a one inch path on the PCB
to system ground, a voltage as high as
V = 27 nH • 500 A/µs = 13.5 V can be
developed.
IXBD4410
IXBD4411
9