VND5004ASP30TR-E STMicroelectronics, VND5004ASP30TR-E Datasheet
VND5004ASP30TR-E
Specifications of VND5004ASP30TR-E
Available stocks
Related parts for VND5004ASP30TR-E
VND5004ASP30TR-E Summary of contents
Page 1
... Application automatic restart allows the device to recover normal operation as soon as a fault condition disappears. Order codes Tube Tape and Reel - VND5004ATR-E VND5004ASP30-E VND5004ASP30TR-E Rev 5 VND5004A-E VND5004ASP30-E for automotive applications PQFN - 12x12 Power lead-less MultiPowerSO-30 pin voltage clamp and load CC Tray VND5004A-E ...
Page 2
Contents Contents 1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . ...
Page 3
VND5004A-E / VND5004ASP30-E List of tables Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 4
List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Page 5
VND5004A-E / VND5004ASP30-E 1 Block diagram and pin configurations Figure 1. Block diagram V clamp GND Reverse battery protection INPUT1 INPUT2 CS_DIS Table 2. Pin functions Name VCC OUTPUT1,2 GND INPUT1,2 CURRENT SENSE1,2 Analog current sense pin, delivers a current ...
Page 6
Block diagram and pin configurations Figure 2. Configuration diagram (not in scale) PQFN -12x12 Power less lead - (bottom view) FOR TEST ONLY CURRENT SENSE 2 CURRENT SENSE 1 FOR TEST ONLY Table 3. Suggested connections for unused and n.c. ...
Page 7
... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in this section for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. ...
Page 8
Electrical specifications Table 4. Absolute maximum ratings (continued) Symbol T Junction operating temperature j T Storage temperature STG 2.2 Thermal data Table 5. Thermal data Symbol Thermal resistance junction-case (MAX) R thj-case (with one channel ON) R Thermal resistance junction-ambient ...
Page 9
VND5004A-E / VND5004ASP30-E 2.3 Electrical characteristics Values specified in this section are for 8V<V stated. Table 6. Power section Symbol Parameter Operating supply V CC voltage V Undervoltage shutdown USD Undervoltage shut-down V USDhyst hysteresis R On-state resistance ON R ...
Page 10
Electrical specifications Table 8. Logic input Symbol V Input low level voltage IL1,2 I Low level input current IL1,2 V Input high level voltage IH1,2 I High level input current V IH1,2 Input hysteresis V I(hyst)1,2 voltage V Input clamp ...
Page 11
VND5004A-E / VND5004ASP30-E Table 10. Current sense (8V<VCC<16V) Symbol Parameter OUT SENSE OUT SENSE Analog sense I SENSE0 current Max analog sense V SENSE output voltage Analog sense output voltage in V ...
Page 12
Electrical specifications Table 11. Truth table Conditions Normal operation Overtemperature Undervoltage Short circuit to GND ≤ 10 mΩ Short circuit Negative output voltage clamp high, the SENSE output ...
Page 13
VND5004A-E / VND5004ASP30-E Table 12. Electrical transient requirements ISO 7637-2: 2004(E) Test pulse (2) 5b ISO 7637-2: 2004(E) Test pulse (2) ( The above test levels must be ...
Page 14
Electrical specifications Figure 6. Waveforms INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn V CC INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn INPUTn CS_DIS LOAD VOLTAGEn LOAD CURRENTn SENSE CURRENTn T j INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn 14/34 NORMAL OPERATION UNDERVOLTAGE V ...
Page 15
VND5004A-E / VND5004ASP30-E 2.4 Electrical characteristics curves Figure 7. Off state output current Iloff (uA) 6 5.4 Off State 4.8 Vcc= 13V Vin= Vout= 0V 4.2 3.6 3 2.4 1.8 1.2 0.6 0 -50 -25 0 Figure 9. Input clamp ...
Page 16
Electrical specifications Figure 13. On state resistance vs. T Ron (mOhm) 6 5.4 I out= 15A Vcc= 13V 4.8 4.2 3.6 3 2.4 1.8 -50 -25 0 Figure 15. Undervoltage shutdown Vusd ( ...
Page 17
VND5004A-E / VND5004ASP30-E Figure 19. CS_DIS high level voltage Vcsdh (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 Figure 21. CS_DIS low level voltage Vcsdl (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 ...
Page 18
Application information 3 Application information Figure 22. Application schematic +5V R µC C ext 3.1 MCU I/Os protection When negative transients are present on the V negative to approximately -1.5V. ST suggests the insertion of resistors (R latching up. The ...
Page 19
VND5004A-E / VND5004ASP30-E 3.3 Maximum demagnetization energy (V Figure 23. Maximum turn off current versus inductance 100 150°C single pulse jstart 100°C repetitive pulse jstart 125°C repetitive pulse ...
Page 20
Package and PC board thermal data 4 Package and PC board thermal data 4.1 MultiPowerSO-30 thermal data Figure 24. MultiPowerSO-30 PC board Note: Layout condition of R area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35µm (front and back side), Copper ...
Page 21
VND5004A-E / VND5004ASP30-E Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) ZTH (°C/ W) 1000 100 10 1 0.1 0.01 0.0001 Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 a. The fitting ...
Page 22
Package and PC board thermal data Equation 1 : pulse calculation formula ⋅ Z THδ where δ Table 13. Thermal parameters for MultiPowerSO-30 Area/island (cm C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 ...
Page 23
VND5004A-E / VND5004ASP30-E 4.2 PQFN - 12x12 Power lead-less thermal data Figure 28. 12x12 Power lead-less package PC board Note: Layout condition of R area= 78mm x 78mm, PCB thickness=2mm, Cu thickness=35µm (front and back side), Copper areas: minimum pad ...
Page 24
Package and PC board thermal data Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse (one channel ON) 100 10 1 0,1 0,001 Figure 31. Thermal fitting model of a double channel HSD in PQFN ...
Page 25
VND5004A-E / VND5004ASP30-E Equation 2 : pulse calculation formula ⋅ δ Z THtp 1 δ Z THδ where δ ⁄ Table 14. Thermal parameters for PQFN - 12x12 Power lead-less Area/island (cm R1 (°C/W) ...
Page 26
Package and packing information 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in ECOPACK packages. ECOPACK is marked on the package and on the inner box label, in compliance with ...
Page 27
VND5004A-E / VND5004ASP30-E Table 15. MultiPowerSO-30 mechanical data Symbol “e” Package and packing information Millimeters Min. Typ. 1.85 0 0.42 0.23 17.1 17.2 18.85 15.9 16 ...
Page 28
Package and packing information 5.3 PQFN - 12x12 Power lead-less mechanical data Figure 33. PQFN - 12x12 Power lead-less outline 28/34 VND5004A-E / VND5004ASP30-E ...
Page 29
VND5004A-E / VND5004ASP30-E Table 16. PQFN - 12x12 Power lead-less mechanical data Symbol Dh1 Dh2 Dh3 Dh4 E Eh1 Eh2 Eh3 ...
Page 30
Package and packing information 5.4 MultiPowerSO-30 packing information The devices can be packed in tube or tape and reel shipments (see the on page 1 for packaging quantities). Figure 34. MultiPowerSO-30 tube shipment (no suffix) C Figure 35. MultiPowerSO-30 tape ...
Page 31
VND5004A-E / VND5004ASP30-E 5.5 PQFN - 12x12 Power lead-less packing information The devices can be packed in tray or tape and reel shipments (see the page 1 for packaging quantities). Figure 36. PQFN - 12x12 Power lead-less tray shipment (no ...
Page 32
Package and packing information Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”) Tape dimensions Dimension A0 ± 0.1 B0 ± 0.1 K0 ± 0.1 F ± 0.1 E ± 0.1 W ± 0.3 P2 ± ...
Page 33
VND5004A-E / VND5004ASP30-E 6 Revision history Table 17. Document revision history Date 15-Sep-2003 21-Jun-2004 22-Mar-2006 02-Jul-2007 10-Dec-2007 Revision 1 Initial release. 2 MultiPowerSO-30 package insertion. 3 Major general update Document converted into new ST corporate template. Contents and lists of ...
Page 34
... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...