VND5004ASP30TR-E STMicroelectronics, VND5004ASP30TR-E Datasheet - Page 23

• Manufacturer Part Number: VND5004ASP30TR-E
• Description: IC DRIVER HIGH SIDE 30-MPSO
• Manufacturer: STMicroelectronics
• Type: High Sider

Specifications of VND5004ASP30TR-E

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 4 mOhm
• Current - Peak Output: 100A
• Voltage - Supply: 4.5 V ~ 27 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 30-MPSO, MultiPowerSO
• Product: Driver ICs - Various
• Supply Voltage (min): 4.5 V
• Supply Current: 6 mA
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Maximum Turn-off Delay Time: 35000 ns
• Maximum Turn-on Delay Time: 25000 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Driver Configuration: Non-Inverting
• Driver Type: High Side
• Input Logic Level: CMOS
• Operating Supply Voltage (max): 27V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 13V
• Turn Off Delay Time: 35us
• Turn On Delay Time (max): 25us
• Operating Temp Range: -40C to 150C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 30
• Package Type: MultiPowerSO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

VND5004A-E / VND5004ASP30-E
4.2
Note:
PQFN - 12x12 Power lead-less thermal data
Figure 28. 12x12 Power lead-less package PC board
Layout condition of R
area= 78mm x 78mm, PCB thickness=2mm, Cu thickness=35µm (front and back side),
Copper areas: minimum pad lay-out).
Figure 29. R
50
45
40
35
30
25
20
0
ON)
thj-amb
th
Vs. PCB copper area in open box free air condition (one channel
and Z
5
th
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heatsink area (cm^2)
10
Package and PC board thermal data
15
20
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