TLE6288R Infineon Technologies, TLE6288R Datasheet - Page 27
![IC SW SMART MULTICHAN PDSO36](/photos/31/44/314459/36pin_dso_sml.jpg)
TLE6288R
Manufacturer Part Number
TLE6288R
Description
IC SW SMART MULTICHAN PDSO36
Manufacturer
Infineon Technologies
Type
High Side/Low Side Driverr
Datasheet
1.TLE6288R.pdf
(32 pages)
Specifications of TLE6288R
Input Type
SPI
Number Of Outputs
6
On-state Resistance
350 mOhm
Current - Output / Channel
2A
Current - Peak Output
3.6A
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
DSO-36
Switch Type
High Side/Low Side
Power Switch Family
TLE 6288 R
Power Switch On Resistance
150mOhm
Mounting
Surface Mount
Supply Current
10mA
Package Type
DSO
Operating Temperature (min)
-40C
Operating Temperature (max)
150C
Operating Temperature Classification
Automotive
Propagation Delay Time
200ns
Pin Count
36
Power Dissipation
800mW
Packages
PG-DSO-36
Channels
6.0
Output Current
2.0
Rds (on)
150 mOhm
Quiescent Current (max.)
0,05 mA
Operating Range
6.0 - 16.0 V
For Use With
DEMOBOARDTLE6288RIN - BOARD DEMO FOR TLE 6288R
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
SP000013727
TLE6288RNT
TLE6288RT
TLE6288RT
TLE6288RNT
TLE6288RT
TLE6288RT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLE6288R
Manufacturer:
SIE
Quantity:
5 510
Part Number:
TLE6288R
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
7
7.1
Figure 18
•
7.2
All thermal resistance values in this document are data from FEM (Finite Element Modelling). The boundary
conditions are chosen according to the JESD51 standard. Therefore, all values can be viewed as reliable and
reproducible.
The high effective thermal conductivity test PCB (2s2p) gives a near best case thermal performance value.
compared to the single layer low effective thermal conductivity PCB (1s). It should be emphasized that values
measured/simulated with these test boards cannot be used to directly predict any particular system application
performance.
In real applications, the
specific multi layer PCBs and a direct thermal connection to the ECU metal-case are often used to improve the
thermal impedance
Data Sheet
Conditions for
– Results based on FEM Simulations
–
–
T
Single Channel operation, 0.8W power dissipation
case
= 125 °C
Application Information
Z
Z
Thermal Application Information
thjc
thjc
0,01
0,1
0,000001
10
Figure 18
Diagram Junction - Case for Single channel operation
Diagram
1
R
thjA
R
.
thjA
can be influenced by the environment and PCB conditions. Thermal vias, application
0,00001
0,0001
Pulse width [s]
27
0,001
0,01
Dutycycle D
0,5
0,2
0,1
0,05
0,02
0,01
Application Information
Rev. 2.4, 2007-08-08
0,1
TLE6288R