MC33186DH2R2 Freescale Semiconductor, MC33186DH2R2 Datasheet - Page 15
MC33186DH2R2
Manufacturer Part Number
MC33186DH2R2
Description
IC DRIVER H-BRIDGE 20-HSOP
Manufacturer
Freescale Semiconductor
Type
H Bridger
Datasheet
1.MC33186VW1.pdf
(21 pages)
Specifications of MC33186DH2R2
Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
150 mOhm
Current - Output / Channel
5A
Current - Peak Output
6.5A
Voltage - Supply
5 V ~ 28 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-HSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC33186DH2R2
Manufacturer:
M-SYSTEM
Quantity:
55
Part Number:
MC33186DH2R2
Manufacturer:
FREESCALE
Quantity:
20 000
performance. The particularity of this package is its copper
base plate on which the power die is soldered. The base plate
is soldered on a PCB to provide heat flow to the ambient and
also to provide a large thermal capacitance.
the power dissipation and transient behavior.
The bottom side area of the copper is 7.8 cm
surface is 2.7 cm
Analog Integrated Circuit Device Data
Freescale Semiconductor
The 20 HSOP package is designed for enhanced thermal
Of course, the more copper area on the PCB, the better
We characterized the 20 HSOP on a double side PCB.
Top Side
Figure 26. PCB Test Layout
2
, see
Figure
26.
Bottom Side
2
. The top
PACKAGING
SOLDERING
soldered on to the test PCB described on
Figure 27
Rth (°C/W)
100
0,1
10
1
0,001
Figure 27. PHSOP20 Thermal Response
shows the thermal response with the device
0,01
0,1
1
t, Time (s)
10
100
Figure
1000
PACKAGING
SOLDERING
26.
10000
33186
15