MC33186DH2R2 Freescale Semiconductor, MC33186DH2R2 Datasheet - Page 17

• Manufacturer Part Number: MC33186DH2R2
• Description: IC DRIVER H-BRIDGE 20-HSOP
• Manufacturer: Freescale Semiconductor
• Type: H Bridger

Specifications of MC33186DH2R2

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 150 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: 6.5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Package and Thermal Considerations
There is a single heat source (P), a single junction temperature (T
resistance (R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 5. Thermal Performance Comparison
Notes:
Analog Integrated Circuit Device Data
Freescale Semiconductor
1.
2.
3.
4.
5.
This thermal addendum is provided as a supplement to the MC33186 technical
The MC33186 is offered in a 20 pin HSOP exposed pad, single die package.
The stated values are solely for a thermal performance comparison of one
Thermal Resistance
Per JEDEC JESD51-2 at natural convection, still air condition.
2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated.
R
R
R
R
θJA
θJB
θJA
θJC
θJA
(1),
(2),
(1),
(5)
).
(2)
(3)
(4)
T
J
=
R
θJA
[°C/W]
9.0
2.0
29
69
.
P
J
), and thermal
Figure 28. Thermal Land Pattern for Direct Thermal
12.3 mm x 7.1 mm Exposed Pad
16.0 mm x 11.0 mm Body
Attachment According to JESD51-5
20 Pin HSOP-EP
1.6 mm Pitch
Note For package dimensions, refer to
the 33186 data sheet.
VW SUFFIX (Pb-FREE)
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
20-PIN HSOP-EP
33186DW
33186VW
98ASH70273A
0.2
DH SUFFIX
HSOP-EP
20-PIN
* All measurements
Soldermast
openings
Thermal vias
connected to top
buried plane
are in millimeters
1.0
0.2
1.0
33186
17