MC33186DH2R2 Freescale Semiconductor, MC33186DH2R2 Datasheet - Page 18

• Manufacturer Part Number: MC33186DH2R2
• Description: IC DRIVER H-BRIDGE 20-HSOP
• Manufacturer: Freescale Semiconductor
• Type: H Bridger

Specifications of MC33186DH2R2

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 150 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: 6.5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
18
33186
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
AGND
PGND
PGND
VBAT
VBAT
OUT1
OUT1
COD
IN1
SF
33186DH1 Pin Connections
1
2
3
4
5
6
7
8
9
10
12.3 x 7.1 mm exposed pad
16.0 mm x 11.0 mm Body
20-Pin HSOP-EP
1.6 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for
thermal testing
Cu heat-spreading areas on board
surface
Natural convection, still air
20
19
18
17
16
15
14
13
12
11
NC
IN2
DI1
CP
VBAT
OUT2
OUT2
DI2
PGND
PGND
Figure 29. Thermal Test Board
Table 6. Thermal Resistance Performance
ambient air.
R
θJA
is the thermal resistance between die junction and
A [mm
300
600
0
A
2
]
Analog Integrated Circuit Device Data
Freescale Semiconductor
R
θJA
70
49
47
[°C/W]