SE97PW,118 NXP Semiconductors, SE97PW,118 Datasheet - Page 3

• Manufacturer Part Number: SE97PW,118
• Description: IC TEMP SENSOR DIMM 8-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of SE97PW,118

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Temperature Threshold: + 165 C
• Full Temp Accuracy: 1 %
• Digital Output - Bus Interface: I2C, SMBus
• Digital Output - Number Of Bits: 11 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Description/function: Memory Module Temperature Sensor
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 250 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4291-2; 935284062118; SE97PW-T

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
[1]
[2]
[3]
SE97_7
Product data sheet
Type number
SE97PW
SE97TK
SE97TL
SE97TP
SE97TP/S900
SE97TL and SE97TP offer improved V
Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
SOT1069-1 is manufactured in APHK Hong Kong and SOT1069-2 is manufactured in APB Bangkok. The third line of the topside
marking will start with ‘P’ for SPHK and ‘n’ for APB.
[1]
[1][2][3]
Ordering information
[1][2][3]
Topside
mark
SE97
SE97
97L
S97
S97
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
TSSOP8
HVSON8
HXSON8
HWSON8 plastic thermal enhanced very very thin small outline package;
HWSON8 plastic thermal enhanced very very thin small outline package;
POR
/EVENT I
plastic thin shrink small outline package; 8 leads;
Description
body width 4.4 mm
plastic thermal enhanced very thin small outline package;
no leads; 8 terminals; body 3 × 3 × 0.85 mm
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.5 mm
no leads; 8 terminals; body 2 × 3 × 0.8 mm
no leads; 8 terminals; body 2 × 3 × 0.8 mm
Rev. 07 — 29 January 2010
OL
DDR memory module temp sensor with integrated SPD, 3.3 V
.
© NXP B.V. 2010. All rights reserved.
Version
SOT530-1
SOT908-1
SOT1052-1
SOT1069-1
SOT1069-2
SE97
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