SE97PW,118 NXP Semiconductors, SE97PW,118 Datasheet - Page 35

IC TEMP SENSOR DIMM 8-TSSOP

SE97PW,118

Manufacturer Part Number
SE97PW,118
Description
IC TEMP SENSOR DIMM 8-TSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SE97PW,118

Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Comparator, Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Temperature Threshold
+ 165 C
Full Temp Accuracy
1 %
Digital Output - Bus Interface
I2C, SMBus
Digital Output - Number Of Bits
11 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Description/function
Memory Module Temperature Sensor
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
250 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4291-2
935284062118
SE97PW-T
NXP Semiconductors
9. Application design-in information
SE97_7
Product data sheet
Fig 24. SE97 interfacing with 1.1 V host controller
0.1 μF
A2
A0
A1
In a typical application, the SE97 behaves as a slave device and interfaces to a bus
master (or host) via the SCL and SDA lines. The EVENT output is monitored by the host,
and asserts when the temperature reading exceeds the programmed values in the alarm
registers. The A0, A1 and A2 pins are directly connected to V
resistors. The SDA and SCL serial interface pins are open-drain I/Os that require pull-up
resistors, and are able to sink a maximum of 3 mA with a voltage drop less than 0.4 V.
Typical pull-up values for SCL and SDA are 10 kΩ, but the resistor values can be changed
in order to meet the rise time requirement if the capacitance load is too large due to
routing, connectors, or multiple components sharing the same bus.
Fig 23. Typical application showing SE97 interfacing with 3.3 V host
SE97
V
V
DD
SS
EVENT
3.3 V
SCL
SDA
10 kΩ
10 kΩ
Rev. 07 — 29 January 2010
slave
A2
A0
A1
DDR memory module temp sensor with integrated SPD, 3.3 V
mother board
SE97
V
V
DD
SS
0.1 μF
B2
B1
V
CC(B)
PCA9509
3.3 V
V
CC(A)
EVENT
EN
A2
A1
SDA
SCL
10 kΩ
(3×)
10 kΩ
10 kΩ
master
EVENT
CONTROLLER
DD
SCL
SDA
or V
HOST
0.1 μF
CONTROLLER
002aab354
SS
1.1 V
HOST
without any pull-up
© NXP B.V. 2010. All rights reserved.
002aad262
SE97
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