AFBR-5805Z Avago Technologies US Inc., AFBR-5805Z Datasheet - Page 2

• Manufacturer Part Number: AFBR-5805Z
• Description: TXRX ATM SONET OC3 3V SC 1X9
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of AFBR-5805Z

• Wavelength: 1310nm
• Applications: General Purpose
• Voltage - Supply: 3.3V
• Connector Type: SC
• Mounting Type: Through Hole
• Function: Provides the system designer with products to implement a range of soluntions for multimode fiber SONET OC-3 (SDH STM-1)
• Product: Transceiver
• Data Rate: 155 Mbps
• Maximum Rise Time: 3 ns/2.2 ns
• Maximum Fall Time: 3 ns/2.2 ns
• Pulse Width Distortion: 1.2 ns (Max)/1.91 ns (Max)
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 3.135 V to 3.5 V or 4.75 V to 5.25 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Package / Case: SIP-9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Transmitter Sections
The transmitter section of the AFBR-5803Z and AFBR-
5805Z series utilize 1300 nm InGaAsP LEDs. These LEDs
are packaged in the optical subassembly portion of the
transmitter section. They are driven by a custom silicon IC
which converts diff erential PECL logic signals, ECL refer-
enced (shifted) to a +3.3 V or +5.0 V supply, into an analog
LED drive current.
Receiver Sections
The receiver section of the AFBR-5803Z and AFBR-
5805Z series utilize InGaAs PIN photo diodes coupled to
a custom silicon transimpedance preampli fi er IC. These
are packaged in the optical subassem bly portion of the
receiver.
These PIN/preamplifi er combina tions are coupled to
a custom quantizer IC which provides the fi nal pulse
shaping for the logic output and the Signal Detect func-
tion. The data output is dif-ferential. The signal detect
output is single-ended. Both data and signal detect
outputs are PECL compat ible, ECL referenced (shifted) to
a 3.3 V or +5.0 V power supply.
Package
The overall package concept for the Avago Technologies
transceivers consists of three basic elements; the two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure 1a and Figure 1b.
The package outline drawing and pin out are shown in
Figures 2a, 2b and 3. The details of this package outline
2
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
Figure 1a. SC Connector Block Diagram
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
PREAMP IC
TOP VIEW
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
LED
and pin out are compliant with the multi source defi nition
of the 1 x 9 SIP. The low profi le of the Avago Technologies
transceiver design complies with the maximum height
allowed for the duplex SC connector over the entire
length of the package.
The optical subassemblies utilize a high volume assem-
bly process together with low cost lens elements which
result in a cost eff ective building block.
The electrical subassembly con sists of a high volume
multilayer printed circuit board on which the IC chips and
various surface-mounted passive circuit elements are at-
tached.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI fi elds.
The outer housing including the duplex SC connector or
the duplex ST ports is molded of fi lled nonconductive
plastic to provide mechanical strength and electrical iso-
lation. The solder posts of the Avago Technologies design
are isolated from the circuit design of the transceiver
and do not require connection to a ground plane on the
circuit board.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the trans ceiver by mating with duplex or
simplex SC or ST connectored fi ber cables.