AFCT-5971ALZ Avago Technologies US Inc., AFCT-5971ALZ Datasheet - Page 3

• Manufacturer Part Number: AFCT-5971ALZ
• Description: TXRX FE SM LASER 125MBS 2X5
• Manufacturer: Avago Technologies US Inc.

Specifications of AFCT-5971ALZ

• Applications: Ethernet
• Data Rate: 125MBd
• Wavelength: 1300nm
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Data Rate Max: 0.125Gbps
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2/2.2ns
• Optical Fall Time: 2/2.2ns
• Operating Temperature Classification: Industrial
• Peak Wavelength: 1360/1580nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Product: Transceiver
• Maximum Rise Time: 2 ns, 2.2 ns
• Maximum Fall Time: 2 ns, 2.2 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 3.1 V to 3.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: DIP-10 with Connector
• Function: Applications specified for signal rate of 125 MBd, for Fast Ethernet, and Singlemode Fiber.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: Singlemode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Figure 3. Block Diagram
3
Package
The overall package concept for these devices consists
of the following basic elements; two optical subas-
semblies, a electrical subassembly and the housing as
illustrated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 5 DIP. The low profile of the Avago Technologies
transceiver design complies with the maximum height
allowed for the LC connector over the entire length of
the package.
The electrical subassembly consists of high volume
multilayer printed circuit board on which the IC and
various surface-mounted passive circuit elements are
attached.
DATA OUT
DATA OUT
SIGNAL
DATA IN
DATA IN
Tx DISABLE
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
DETECT
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
R
T
X
X
SUPPLY
SUPPLY
R
X
MONITORING
LASER DIODE
MODULATOR
LASER BIAS
GROUND
CASE
The optical subassemblies are attached to the electrical
subassembly. These two units are then fitted within the
outer housing of the transceiver. The housing is then
encased with a metal EMI protective shield.
The electrical subassembly carries the signal pins that
exit from the bottom of the transceiver. The solder
posts are designed to provide the mechanical strength
required to withstand the loads imposed on the trans-
ceiver by mating with the LC connectored fiber cables.
Although they are not connected electrically to the
transceiver, it is recommended to connect them to
chassis ground.
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
NOTE
LC
RECEPTACLE