AFCT-5971ALZ Avago Technologies US Inc., AFCT-5971ALZ Datasheet - Page 9

• Manufacturer Part Number: AFCT-5971ALZ
• Description: TXRX FE SM LASER 125MBS 2X5
• Manufacturer: Avago Technologies US Inc.

Specifications of AFCT-5971ALZ

• Applications: Ethernet
• Data Rate: 125MBd
• Wavelength: 1300nm
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Data Rate Max: 0.125Gbps
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2/2.2ns
• Optical Fall Time: 2/2.2ns
• Operating Temperature Classification: Industrial
• Peak Wavelength: 1360/1580nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Product: Transceiver
• Maximum Rise Time: 2 ns, 2.2 ns
• Maximum Fall Time: 2 ns, 2.2 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 3.1 V to 3.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: DIP-10 with Connector
• Function: Applications specified for signal rate of 125 MBd, for Fast Ethernet, and Singlemode Fiber.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: Singlemode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

DIMENSIONS IN MILLIMETERS (INCHES)
The AFCT-5971LZ/ALZ is intrinsically eye safe and does
not require shut down circuitry.
Signal Detect
The Signal Detect circuit provides a deasserted output
signal when the optical link is broken (or when the re-
mote transmitter is OFF). The Signal Detect threshold is
set to transition from a high to low state between the
minimum receiver input optical power and -45 dBm
avg. input optical power indicating a definite optical
fault (e.g. unplugged connector for the receiver or
transmitter, broken fiber, or failed far-end transmitter or
data source). The Signal Detect does not detect receiver
data error or error-rate. Data errors can be determined
by signal processing offered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electron-
ic equipment. Success in controlling generated Electro-
Figure 7. Recommended Board Layout Hole Pattern
9
(0.525)
(0.299)
13.34
7.59
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
*4
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.18)
4.57
(0.700)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
17.8
4 x 1.78
(0.07)
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
magnetic Interference (EMI) enables the designer to pass
a governmental agency’s EMI regulatory standard and
more importantly, it reduces the possibility of interfer-
ence to neighboring equipment. Avago Technologies
has designed the AFCT-5971LZ/ALZ to provide excel-
lent EMI performance. The EMI performance of a chassis
is dependent on physical design and features which
help improve EMI suppression. Avago Technologies en-
courages using standard RF suppression practices and
avoiding poorly EMI-sealed enclosures.
Avago Technologies’ LC transceivers (AFCT-5971LZ/ALZ)
have nose shields which provide a convenient chassis
connection to the nose of the transceiver. This nose
shield improves system EMI performance by effec-
tively closing off the LC aperture. The recommended
transceiver position, PCB layout and panel opening for
these devices are the same, making them mechanically
drop-in compatible. Figure 8 shows the recommended
positioning of the transceivers with respect to the PCB
and faceplate.
9.59
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
(0.055 ±0.004)
4 x Ø 1.4 ±0.1
*5
(0.079)
2
NOTES:
1. THIS
2. THE HATCHED AREAS ARE KEEP-OUT AREAS
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16
*4. THE MOUNTING STUDS SHOULD BE
*5. HOLES FOR OPTIONAL HOUSING LEADS
RECOMMENDED CIRCUIT BOARD LAYOUT
FOR THE SFF TRANSCEIVER.
RESERVED FOR HOUSING STANDOFFS. NO
METAL TRACES OR GROUND CONNECTION
IN KEEP-OUT AREAS.
PCB HOLES (10 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS). PACKAGE GROUNDING TABS
SHOULD BE CONNECTED TO SIGNAL
GROUND.
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER
SFF TRANSCEIVERS.
MUST BE TIED TO SIGNAL GROUND.
FIGURE
DESCRIBES
MSA