AD9248BCP-40EBZ Analog Devices Inc, AD9248BCP-40EBZ Datasheet - Page 45

BOARD EVAL WITH AD9248BCP-40

AD9248BCP-40EBZ

Manufacturer Part Number
AD9248BCP-40EBZ
Description
BOARD EVAL WITH AD9248BCP-40
Manufacturer
Analog Devices Inc
Datasheets

Specifications of AD9248BCP-40EBZ

Number Of Adc's
2
Number Of Bits
14
Sampling Rate (per Second)
40M
Data Interface
Parallel
Inputs Per Adc
1 Differential
Input Range
2 Vpp
Power (typ) @ Conditions
360mW @ 40MSPS
Voltage Supply Source
Single
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9248BCP-40
Silicon Manufacturer
Analog Devices
Application Sub Type
ADC
Kit Application Type
Data Converter
Silicon Core Number
AD9248
Kit Contents
Board
Power Dissipation Pd
400mW
Termination Type
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
AD9248
Figure 58. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9248 LFCSP has an integrated heat slug
that improves the thermal and electrical properties of the
package when locally attached to a ground plane at the PCB.
A thermal (filled) via array to a ground plane beneath the
part provides a path for heat to escape the package, lowering
junction temperature. Improved electrical performance
also results from the reduction in package parasitics due to
proximity of the ground plane. Recommended array is 0.3 mm
vias on 1.2 mm pitch. θ
= 26.4°C/W with this recommended
JA
configuration. Soldering the slug to the PCB is a requirement
for this package.
Figure 59. Thermal Via Array
Rev. B | Page 45 of 48

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