AD9272-65EBZ Analog Devices Inc, AD9272-65EBZ Datasheet - Page 11

• Manufacturer Part Number: AD9272-65EBZ
• Description: BOARD EVAL AD9272
• Manufacturer: Analog Devices Inc

Specifications of AD9272-65EBZ

• Design Resources: Powering AD9272 with ADP5020 Switching Regulator PMU for Increased Efficiency (CN0135)
• Number Of Adc's: 8
• Number Of Bits: 12
• Sampling Rate (per Second): 65M
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: 733 mVpp
• Power (typ) @ Conditions: 1.69W @ 65MSPS
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9272
• Silicon Manufacturer: Analog Devices
• Application Sub Type: ADC
• Kit Application Type: Data Converter
• Silicon Core Number: AD9272
• Kit Contents: Board
• Development Tool Type: Hardware - Eval/Demo Board
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Electrical
Environmental
AVDD1
AVDD2
DRVDD
GND
AVDD2
AVDD1
AVDD2
Digital Outputs
CLK+, CLK−,
LI-x, LO-x, LOSW-x
CWDx−, CWDx+
PDWN, STBY, SCLK, CSB
RBIAS, VREF, SDIO
Operating Temperature
Storage Temperature
Maximum Junction
Lead Temperature
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
GAIN+,GAIN−
Range (Ambient)
Range (Ambient)
Temperature
(Soldering, 10 sec)
GND
GND
GND
GND
AVDD1
LG-x
GND
GND
With
Respect To
DRVDD
DRVDD
GND
GND
GND
GND
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
−2.0 V to +2.0 V
−2.0 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. C | Page 11 of 44
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/sec)
0.0
1.0
2.5
1
ESD CAUTION
θ
pad is soldered to the PCB.
JA
is for a 4-layer PCB with a solid ground plane (simulated). The exposed
θ
20.3
14.4
12.9
JA
1
θ
N/A
7.6
N/A
JB
θ
N/A
4.7
N/A
JC
AD9272
Unit
°C/W
°C/W
°C/W