DEMO9S08LG32 Freescale Semiconductor, DEMO9S08LG32 Datasheet - Page 2

• Manufacturer Part Number: DEMO9S08LG32
• Description: DEMO BOARD FOR LG32 FAMILY MCU
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08LG32

• Contents: Board, CD
• Processor To Be Evaluated: MC9S08LG32x
• Data Bus Width: 8 bit
• Interface Type: USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08LG
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08LG32
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

1
2
3
4
5
List of Figures
2
Figure 1. MC9S08LG32 Series Block Diagram . . . . . . . . . . . . . . 3
Figure 2. 80-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. 64-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. 48-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Typical Low-side Drive (sink) characteristics – High Drive
Figure 6. Typical Low-side Drive (sink) characteristics – Low Drive
Figure 7. Typical High-side Drive (source) characteristics – High
Figure 8. Typical High-side Drive (source) characteristics – Low Drive
Figure 9. Typical Run I
Figure 10.Typical Run I
Figure 11.Typical Run I
Figure 12.Typical Run I
Figure 13.Typical Stop2 I
Figure 14.Typical Stop3 I
Figure 15.Typical Crystal or Resonator Circuit: High Range and Low
Figure 16.Typical Crystal or Resonator Circuit: Low Range/Low
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .25
2.11 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
2.12 LCD Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
2.13 Flash Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .34
2.14 EMC Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.1
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.1
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .10
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .10
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .11
ESD Protection and Latch-Up Immunity . . . . . . . . . . . .12
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .17
External Oscillator (XOSC) Characteristics . . . . . . . . .22
Internal Clock Source (ICS) Characteristics . . . . . . . . .24
2.11.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . .29
2.11.2 TPM Module Timing . . . . . . . . . . . . . . . . . . . . .30
2.11.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
2.14.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . .35
2.14.2 Conducted Transient Susceptibility . . . . . . . . . .35
Device Numbering System . . . . . . . . . . . . . . . . . . . . . .39
Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.1.1 80-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .40
4.1.2 64-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .43
4.1.3 48-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . .46
(PTxDSn = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
(PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Drive (PTxDSn = 1). . . . . . . . . . . . . . . . . . . . . . . . . . . 15
(PTxDSn = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Range/High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DD
DD
DD
DD
DD
DD
for FBE Mode at 1 MHz. . . . . . . . . . . 19
for FBE Mode at 20 MHz . . . . . . . . . 20
for FEE Mode at 1 MHz . . . . . . . . . . 20
for FEE Mode at 20 MHz . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
MC9S08LG32 Series Data Sheet, Rev. 7
Table of Contents
List of Tables
Figure 17.Internal Oscillator Deviation from Trimmed Frequency 25
Figure 18.ADC Input Impedance Equivalency Diagram. . . . . . . 26
Figure 19.Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 20.IRQ/KBIPx Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 21.Timer External Clock . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 22.Timer Input Capture Pulse . . . . . . . . . . . . . . . . . . . . . 30
Figure 23.SPI Master Timing (CPHA = 0) . . . . . . . . . . . . . . . . . 32
Figure 24.SPI Master Timing (CPHA =1) . . . . . . . . . . . . . . . . . . 32
Figure 25.SPI Slave Timing (CPHA = 0) . . . . . . . . . . . . . . . . . . 33
Figure 26.SPI Slave Timing (CPHA = 1) . . . . . . . . . . . . . . . . . . 33
Figure 27.4 MHz, Positive Polarity Pins 1 – 41 . . . . . . . . . . . . . 36
Figure 28.4 MHz, Positive Polarity Pins 42 – 80 . . . . . . . . . . . . 36
Figure 29.4 MHz, Negative Polarity Pins 1 – 41. . . . . . . . . . . . . 37
Figure 30.4 MHz, Negative Polarity Pins 42 – 80. . . . . . . . . . . . 37
Figure 31.Device Number Example for Auto Parts. . . . . . . . . . . 39
Figure 32.Device Number Example for IMM Parts. . . . . . . . . . . 39
Figure 33.80-pin LQFP Package Drawing (Case 917A, Doc
Figure 34.64-pin LQFP Package Drawing (Case 840F, Doc
Figure 35.48-pin LQFP Package Drawing (Case 932, Doc
Table 1. MC9S08LG32 Series Features by MCU and Package . 4
Table 2. Pin Availability by Package Pin-Count . . . . . . . . . . . . . . 8
Table 3. Parameter Classifications . . . . . . . . . . . . . . . . . . . . . . 10
Table 4. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 11
Table 5. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 11
Table 6. ESD and Latch-Up Test Conditions . . . . . . . . . . . . . . . 12
Table 7. ESD and Latch-Up Protection Characteristics. . . . . . . 13
Table 8. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Supply Current Characteristics. . . . . . . . . . . . . . . . . . 17
Table 10.Oscillator Electrical Specifications (Temperature Range =
Table 11.ICS Frequency Specifications (Temperature Range =
Table 12.12-bit ADC Operating Conditions . . . . . . . . . . . . . . . . 25
Table 13.12-bit ADC Characteristics (V
Table 14.Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 15.TPM Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 16.SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 17.LCD Electricals, 3 V Glass . . . . . . . . . . . . . . . . . . . . . 34
Table 18.Flash Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 19.Radiated Emissions, Electric Field . . . . . . . . . . . . . . . 35
Table 20.Conducted Susceptibility, EFT/B . . . . . . . . . . . . . . . . . 35
Table 21.Susceptibility Performance Classification . . . . . . . . . . 38
Table 22.Device Numbering System . . . . . . . . . . . . . . . . . . . . . 38
Table 23.Package Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 24.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
#98ASS23237W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
#98ASS23234W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
#98ASH00962A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
–40 °C to 105 °C Ambient) . . . . . . . . . . . . . . . . . . . . . 22
–40 °C to 105 °C Ambient) . . . . . . . . . . . . . . . . . . . . . 24
V
SSAD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Freescale Semiconductor
REFH
= V
DDAD
, V
REFL
=