NBSG111BAEVB ON Semiconductor, NBSG111BAEVB Datasheet - Page 11

• Manufacturer Part Number: NBSG111BAEVB
• Description: BOARD EVALUATION BBG NBSG111BA
• Manufacturer: ON Semiconductor

Specifications of NBSG111BAEVB

• Main Purpose: Clock/Data Driver
• Utilized Ic / Part: NBSG111
• Primary Attributes: W/RSECL Outputs
• Technology Type: Evaluation Board
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: NBSG111
• Other names: NBSG111BAEVB; NBSG111BAEVBOS

4 X
0.15
B
E1
A
C
E
e
É É
É É
7
TERMINAL A1 CORNER
6
VIEW Z−Z
5
PLASTIC 8x8 mm (1.0 mm pitch) BGA FLIP CHIP PACKAGE
D1
D
4
3
e
2
1
A
B
C
D
E
G
F
DETAIL A
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
PACKAGE DIMENSIONS
49 X
NBSG111BAEVB
http://onsemi.com
CASE 489A−02
BA SUFFIX
FCBGA−49
b
0.15
0.08
ISSUE A
A2
NOTE 3
11
M
M
C
C
A
A
B
Z
Z
SEATING
PLANE
NOTE 4
49 X
0.12 C
C
NOTE 5
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM C (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
6. 489A−01 OBSOLETE, NEW STANDARD 489A−02.
0.20 C
Y14.5M−1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE C.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
(ROTATED 90
DIM
A1
A2
D1
E1
A
b
D
E
e
DETAIL A
MILLIMETERS
MIN
0.40
−−−
0.3
8.00 BSC
6.00 BSC
8.00 BSC
6.00 BSC
1.00 BSC
0.91 REF
_
MAX
A1
1.40
0.60
0.5
C.W.)