TOOLSTICK542PP Silicon Laboratories Inc, TOOLSTICK542PP Datasheet - Page 24
TOOLSTICK542PP
Manufacturer Part Number
TOOLSTICK542PP
Description
PLATFORM PROG TOOLSTICK F542
Manufacturer
Silicon Laboratories Inc
Series
ToolStickr
Type
Microcontroller Programmerr
Specifications of TOOLSTICK542PP
Contents
2 Boards and USB Connecting Cable
Processor To Be Evaluated
C8051F542
Interface Type
USB
Operating Supply Voltage
2.7 V to 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051F542
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1718
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C8051F54x
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
E
Table 4.2. QFP-32 Landing Diagram Dimensions
8.40
8.40
Min
Figure 4.2. QFP-32 Landing Diagram
0.80 BSC
Max
8.50
8.50
Rev. 1.1
Dimension
X1
Y1
0.40
1.25
Min
Max
0.50
1.35
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