IRFZ34E International Rectifier, IRFZ34E Datasheet

MOSFET N-CH 60V 28A TO-220AB

IRFZ34E

Manufacturer Part Number
IRFZ34E
Description
MOSFET N-CH 60V 28A TO-220AB
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRFZ34E

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
42 mOhm @ 17A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
28A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
30nC @ 10V
Input Capacitance (ciss) @ Vds
680pF @ 25V
Power - Max
68W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRFZ34E

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFZ34E
Manufacturer:
IR
Quantity:
12 500
Company:
Part Number:
IRFZ34E
Quantity:
70 000
Part Number:
IRFZ34EPBF
Manufacturer:
EPCOS
Quantity:
30 000
Thermal Resistance
Description
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
the lowest possible on-resistance per silicon area.
This benefit, combined with the fast switching speed
and ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal
resistance and low package cost of the TO-220
contribute to its wide acceptance throughout the
industry.
I
I
I
P
V
E
I
E
dv/dt
T
T
AR
D
D
DM
R
R
R
J
AS
AR
STG
D
GS
@ T
@ T
@T
JC
CS
JA
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Ease of Paralleling
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
Min.
––––
––––
––––
300 (1.6mm from case )
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
S
D
Max.
0.46
112
± 20
TO-220AB
6.8
5.0
28
20
68
97
17
––––
––––
Typ.
0.50
®
IRFZ34E
Power MOSFET
R
DS(on)
V
DSS
PD - 9.1672A
I
D
= 28A
Max.
––––
2.2
= 0.042
62
= 60V
Units
W/°C
V/ns
Units
mJ
mJ
°C
W
°C/W
A
V
A
11/4/97

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IRFZ34E Summary of contents

Page 1

... Storage Temperature Range STG Soldering Temperature, for 10 seconds Mounting torque, 6- srew Thermal Resistance R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA G Parameter @ 10V GS @ 10V GS Parameter PD - 9.1672A IRFZ34E ® HEXFET Power MOSFET 60V DSS R = 0.042 DS(on 28A D S TO-220AB Max 112 68 0.46 ± ...

Page 2

... IRFZ34E Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(ON) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... V , Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics 4.5V ° 100 ° 175 25V DS 20µs PULSE WIDTH IRFZ34E 1000 VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 100 5.0V BOTTOM 4. 20µs PULSE WIDTH T = 175 C 0.1 0 Drain-to-Source Voltage (V) DS Fig 2. Typical Output Characteristics 2 ...

Page 4

... IRFZ34E 1200 iss rss gd 1000 oss ds C iss 800 600 C oss 400 C rss 200 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100 ° 150 0.1 0.2 0.6 1.0 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage f = 1MHz ...

Page 5

... RESPONSE) 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig 10a. Switching Time Test Circuit V 90% 125 150 175 ° 10% V Fig 10b. Switching Time Waveforms 0.001 t , Rectangular Pulse Duration (sec) 1 IRFZ34E D.U. Pulse Width µs Duty Factor ...

Page 6

... IRFZ34E Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform L D.U. 0.01 V (BR)DSS V DD 200 150 100 100 Starting T , Junction Temperature ( C) J Fig 12c. Maximum Avalanche Energy Vs. Drain Current Current Regulator Same Type as D.U.T. ...

Page 7

... Fig 14. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period Current di/dt Diode Recovery dv/dt Forward Drop 5% IRFZ34E + =10V * ...

Page 8

... IRFZ34E Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches) 10 10 .87 (. .62 (. 5.24 (. 4.84 (. .09 (. .47 (. .40 (. . & 14 82 LING SIO N : INC H Part Marking Information TO-220AB ITH WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR FAR EAST: K& ...

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