MC9S12E64CFUE Freescale Semiconductor, MC9S12E64CFUE Datasheet - Page 600

• Manufacturer Part Number: MC9S12E64CFUE
• Description: IC MCU 64K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E64CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Package: 80PQFP
• Family Name: HCS12
• Maximum Speed: 25 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 60
• Interface Type: SCI/SPI
• On-chip Adc: 16-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 12
• Processor Series: S12E
• Core: HCS12
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 25 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 58
• Ram Memory Size: 4KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix B Package Information
B.2
600
DATUM
PLANE
L
SEATING
PLANE
-A-
-C-
-H-
80-Pin QFP Package
C
61
80
60
E
DETAIL C
1
H
Figure B-2. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
0.20
0.05 A-B
0.20
G
W
M
M
X
H
C
A
S
K
L
A-B
A-B
DETAIL A
U
R
-D-
T
MC9S12E128 Data Sheet, Rev. 1.07
S
S
D
D
Q
S
S
20
M
M
41
NOTES:
40
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B- AND -D- TO BE
5. DIMENSIONS S AND V TO BE DETERMINED
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE DAMBAR
21
ANSI Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -H-.
AT SEATING PLANE -C-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
-B-
B
DETAIL C
-H-
0.10
V
DATUM
PLANE
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
Freescale Semiconductor
B
B
M
C
F
D
A-B
DIM
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
U
V
X
F
J
L
T
S
-A-,-B-,-D-
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
N
0.65 BSC
---
D
5
0
0
1.6 REF
P
S
14.10
14.10
17.45
17.45
MAX
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
10
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7