PIC18F1320-E/P Microchip Technology, PIC18F1320-E/P Datasheet - Page 11
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PIC18F1320-E/P
Manufacturer Part Number
PIC18F1320-E/P
Description
IC MCU FLASH 4KX16 EEPROM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F1220-ISO.pdf
(308 pages)
3.PIC18F1220-ISO.pdf
(8 pages)
4.PIC18F1220-ISO.pdf
(6 pages)
5.PIC18F1220-ISO.pdf
(10 pages)
6.PIC18F1220-ISO.pdf
(4 pages)
7.PIC18F1320-ISS.pdf
(36 pages)
8.PIC18F1220-EP.pdf
(310 pages)
Specifications of PIC18F1320-E/P
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Package
18PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
FIGURE 3-2:
FIGURE 3-3:
3.3
Programming code memory is accomplished by first
loading data into the appropriate write buffers and then
initiating a programming sequence. Each panel in the
code memory space (see Figure 2-7 and Figure 2-8)
has an 8-byte deep write buffer that must be loaded
prior to initiating a write sequence. The actual memory
write sequence takes the contents of these buffers and
programs the associated EEPROM code memory.
The programming duration is externally timed and is
controlled by PGC. After a “Start Programming” com-
mand is issued (4-bit command, ‘1111’), a NOP is
issued, where the 4th PGC is held high for the duration
of the programming time, P9 (see Figure 3-6).
2010 Microchip Technology Inc.
PGC
PGD
4-Bit Command
Code Memory Programming
1
0
2
0
3
1
4
1
Delay P11 + P10
Load Address
Entire Device
P5
Pointer to
BULK ERASE FLOW
Write 80h
BULK ERASE TIMING
3C0004h
to Erase
Done
Time
1
Start
0
Data Payload
2
0
16-Bit
15 16
0
0
P5A
4-Bit Command
1
0
2
0
3
0
4
0
PGD = Input
P5
1
0
2
0
NOP
3.2.1
When using low-voltage ICSP, the part must be
supplied by the voltage specified in parameter D111 if a
Bulk Erase is to be executed. All other Bulk Erase
details as described above apply.
If it is determined that a program memory erase must
be performed at a supply voltage below the Bulk Erase
limit, refer to the erase methodology described in
Section 3.3.1 “Modifying Code Memory”.
If it is determined that a data EEPROM erase must be
performed at a supply voltage below the Bulk Erase
limit, follow the methodology described in Section 3.4
“Data EEPROM Programming” and write zeros to the
array.
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time
specified by parameter P10 to allow high-voltage
discharge of the memory array.
The code sequence to program a device is shown in
Table 3-3. The flowchart shown in Figure 3-5 depicts
the logic necessary to completely write a device.
15 16
Note:
0
0
P5A
PIC18FX220/X320
4-Bit Command
1
LOW-VOLTAGE ICSP BULK ERASE
0
The TBLPTR register must contain the
same offset value when initiating the
programming sequence as it did when the
write buffers were loaded.
2
0
3
0
4
0
Erase Time
P11
DS39592F-page 11
P10
Data Payload
16-Bit
1
n
2
n