PIC18F27J53-I/ML Microchip Technology, PIC18F27J53-I/ML Datasheet - Page 251
![IC PIC MCU 128KB FLASH 28QFN](/photos/18/33/183309/qfn-28_sml.jpg)
PIC18F27J53-I/ML
Manufacturer Part Number
PIC18F27J53-I/ML
Description
IC PIC MCU 128KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F26J53-ISS.pdf
(586 pages)
4.PIC18F26J53-ISS.pdf
(12 pages)
Specifications of PIC18F27J53-I/ML
Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
*
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
16
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Controller Family/series
PIC18
Cpu Speed
48MHz
Embedded Interface Type
I2C, SPI, USART
Digital Ic Case Style
QFN
Supply Voltage Range
1.8V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18LF24J10-ISS PDF datasheet
- PIC18F26J13-ISS PDF datasheet #2
- PIC18F26J53-ISS PDF datasheet #3
- PIC18F26J53-ISS PDF datasheet #4
- Current page: 251 of 496
- Download datasheet (5Mb)
15.6.13.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user releases SDAx and the pin is allowed to
float high, the BRG is loaded with SSPxADD and
counts down to zero. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
FIGURE 15-36:
FIGURE 15-37:
2010 Microchip Technology Inc.
A low level is sampled on SDAx when SCLx
goes from low level to high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
Preliminary
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’,
If SDAx is sampled high, the BRG is reloaded and
begins counting. If SDAx goes from high-to-low before
the BRG times out, no bus collision occurs because no
two masters can assert SDAx at exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition, see
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG
is reloaded and begins counting. At the end of the
count, regardless of the status of the SCLx pin, the
SCLx pin is driven low and the Repeated Start
condition is complete.
PIC18(L)F2X/4XK22
Figure
T
Cleared by software
BRG
15-36.
Interrupt cleared
by software
’0’
’0’
DS41412D-page 251
’0’
Figure
15-35).
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