PIC18F27J53-I/ML Microchip Technology, PIC18F27J53-I/ML Datasheet - Page 425
![IC PIC MCU 128KB FLASH 28QFN](/photos/18/33/183309/qfn-28_sml.jpg)
PIC18F27J53-I/ML
Manufacturer Part Number
PIC18F27J53-I/ML
Description
IC PIC MCU 128KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F26J53-ISS.pdf
(586 pages)
4.PIC18F26J53-ISS.pdf
(12 pages)
Specifications of PIC18F27J53-I/ML
Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
*
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
16
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Controller Family/series
PIC18
Cpu Speed
48MHz
Embedded Interface Type
I2C, SPI, USART
Digital Ic Case Style
QFN
Supply Voltage Range
1.8V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18LF24J10-ISS PDF datasheet
- PIC18F26J13-ISS PDF datasheet #2
- PIC18F26J53-ISS PDF datasheet #3
- PIC18F26J53-ISS PDF datasheet #4
- Current page: 425 of 496
- Download datasheet (5Mb)
27.2
2010 Microchip Technology Inc.
D011
D013
D014
D015
D16
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
Secondary Oscillator
A/D Converter
A/D Converter
Comparators
Comparators
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
(3)
(3)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
Typ
200
260
200
260
260
0.8
0.9
0.8
0.9
50
50
50
50
50
1
9
9
9
9
9
+60°C
Typ
Preliminary
+85°C
Max
15
15
15
15
15
80
80
80
80
80
3
4
3
4
5
+125°C
-40°C T
-40°C T
Max
15
15
15
15
15
80
80
80
80
80
3
4
3
4
5
PIC18(L)F2X/4XK22
A
A
Units
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
+125°C
+125°C
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
V
DD
32 kHz on SOSC
A/D on, not converting
Adder to A/D current for
FRC conversion clock.
LP mode
HP mode
Conditions
DS41412D-page 425
Notes
DD
or V
SS
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