MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 1290

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B Package Information
B.2
1292
PIN 1
IDENT
C
L
C1
112-Pin LQFP Package
28
1
4X
C2
112
29
VIEW Y
0.050
VIEW AB
0.20
S1
A1
Figure B-2. 112-Pin LQFP Mechanical Dimensions (Case No. 987)
T
L-M
N
A
S
N
(Y)
(Z)
(K)
E
MC9S12XDP512 Data Sheet, Rev. 2.21
R
4X 28 TIPS
3
2
R2
R
R1
85
56
1
84
57
M
0.20
B1
GAGE PLANE
0.25
VIEW AB
T
T
V1
L-M
0.10
B
SEATING
PLANE
N
T
V
112X
C L
ROTATED 90 COUNTERCLOCKWISE
J1
J1
NOTES:
J
1. DIMENSIONING AND TOLERANCING PER
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
4. DIMENSIONS S AND V TO BE DETERMINED AT
5. DIMENSIONS A AND B DO NOT INCLUDE
6. DIMENSION D DOES NOT INCLUDE DAMBAR
ASME Y14.5M, 1994.
SEATING PLANE, DATUM T.
SEATING PLANE, DATUM T.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B INCLUDE MOLD MISMATCH.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
SECTION J1-J1
0.13
DIM
AA
A1
B1
C1
C2
R1
R2
S1
V1
A
B
C
D
E
G
K
P
S
V
Y
F
J
Z
1
2
3
108X
VIEW Y
0.050
1.350
0.270
0.450
0.270
0.090
0.100
0.100
0.090
MILLIMETERS
M
MIN
11
11
20.000 BSC
10.000 BSC
20.000 BSC
10.000 BSC
22.000 BSC
11.000 BSC
22.000 BSC
11.000 BSC
3
0.650 BSC
0.500 REF
0.325 BSC
0.250 REF
1.000 REF
0
---
D
F
G
T
1.600
0.150
1.450
0.370
0.750
0.330
0.170
0.200
0.200
0.160
4X
MAX
13
Freescale Semiconductor
13
L-M
8
7
P
X=L, M OR N
X
N
AA
BASE
METAL