MC9S12XDT256MAA Freescale Semiconductor, MC9S12XDT256MAA Datasheet - Page 32

• Manufacturer Part Number: MC9S12XDT256MAA
• Description: IC MCU 256K FLASH 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDT256MAA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 59
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 1 Device Overview MC9S12XD-Family
1.1.1
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HCS12X Core
— 16-bit HCS12X CPU
— EBI (external bus interface)
— MMC (module mapping control)
— INT (interrupt controller)
— DBG (debug module to monitor HCS12X CPU and XGATE bus activity)
— BDM (background debug mode)
XGATE (peripheral coprocessor)
— Parallel processing module off loads the CPU by providing high-speed data processing and
— Data transfer between Flash EEPROM, RAM, peripheral modules, and I/O ports
PIT (periodic interrupt timer)
— Four timers with independent time-out periods
— Time-out periods selectable between 1 and 2
CRG (clock and reset generator)
— Low noise/low power Pierce oscillator
— PLL
— COP watchdog
— Real time interrupt
— Clock monitor
— Fast wake-up from stop mode
Port H & Port J with interrupt functionality
— Digital filtering
— Programmable rising or falling edge trigger
Memory
— 512, 256 and 128-Kbyte Flash EEPROM
— 4 and 2-Kbyte EEPROM
— 32, 16 and 12-Kbyte RAM
One 16-channel and one 8-channel ADC (analog-to-digital converter)
– Upward compatible with MC9S12 instruction set
– Interrupt stacking and programmer’s model identical to MC9S12
– Instruction queue
– Enhanced indexed addressing
– Enhanced instruction set
transfer
MC9S12XD/B/A Family Features
This section lists the features which are available on
MC9S12XDP512RMV2. See
availability of features and memory sizes on other family members.
MC9S12XDP512 Data Sheet, Rev. 2.21
Appendix E Derivative Differences
24
bus clock cycles
for
Freescale Semiconductor