TWR-56F8257 Freescale Semiconductor, TWR-56F8257 Datasheet - Page 71

• Manufacturer Part Number: TWR-56F8257
• Description: TOWER SYSTEM KIT MC56F8257
• Manufacturer: Freescale Semiconductor
• Type: DSC, Digital Signal Controllerr

Specifications of TWR-56F8257

• Contents: Board, Cables, Documentation, DVD
• For Use With/related Products: Freescale Tower System, MC56F8257
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1
2
7.27
7.28
1
2
3
4
7.29
See
provides additional details for optimizing power consumption for a given application.
Power consumption is given by the following equation:
A, the internal [static] component, consists of the DC bias currents for the oscillator, leakage currents, PLL, and voltage
references. These sources operate independently of processor state or operating frequency.
Freescale Semiconductor
No guaranteed specification within 5% of V
LSB = 0.806 mV
Offset when the degree of hysteresis is set to its minimum value.
The range of hysteresis is based on simulation only. This range varies from part to part.
Measured with an input waveform that switches 30 mV above and below the reference, to the CMPO output pin. V
V
Measured with an input waveform that switches 30 mV above and below the reference, to the CMPO output pin. V
V
LVI_WARNING
LVI_WARNING
Section 7.7, “Supply Current
Propagation Delay, Low Speed Mode (EN=1,
Propagation Delay, high speed mode (EN=1,
5-Bit
HSCMP Specifications
Analog comparator hysteresis
Optimize Power Consumption
Analog input offset voltage
=> LVI_WARNING NOT ASSERTED.
=> LVI_WARNING NOT ASSERTED.
Analog input voltage
Reference Inputs
Output Range
Setup Delay
PMODE=1),
PMODE=0),
Digital-to-Analog Converter (DAC) Parameters
Parameter
Parameter
Step size
Total power =
Characteristics,” for a list of I
MC56F825x/MC56F824x Digital Signal Controller, Rev. 3
1
2
Table 43. 5-Bit DAC Specifications
DDA
Table 44. HSCMP Specifications
or V
SSA
+C: internal [dynamic] component
+D: external [dynamic] component
+B: internal [state-dependent] component
+E: external [static] component
A:
V
Symbol
t
V
DACOUT
PRGST
Vin
STEP
Symbol
internal [static] component
t
t
DHSN
AINIT
V
V
V
AIN
AIO
H
DD
4
3
requirements for the MC56F825x/MC56F824x. This section
3Vin/128
V
Vin/32
V
TBD
Min
SSA
DDA
Min
—
—
—
—
– 0.01
Vin/32
TBD
Typ
—
—
1 to 16
Typ
400
70
—
—
5Vin/128
V
V
Max
TBD
DDA
Vin
DDA
Max
140
600
40
—
+ 0.01
Specifications
Unit
mV
ns
ns
V
DDA
DDA
Unit
mV
mV
ns
ns
V
>
>
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