PIC16F767-E/ML Microchip Technology, PIC16F767-E/ML Datasheet - Page 258

IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,28PIN,PLASTIC

PIC16F767-E/ML

Manufacturer Part Number
PIC16F767-E/ML
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F767-E/ML

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC16F7X7
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
DS30498C-page 256
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Drawing No. C04-105
A1
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
TOP VIEW
Dimension Limits
E
Units
D2
A1
A3
E2
n
e
A
E
D
b
L
OPTIONAL
INDEX
AREA
MIN
D
.031
.000
.232
.140
.232
.140
.009
.020
EXPOSED
METAL
INDICATORS
A
ALTERNATE
PAD OUTLINE
.008 REF
PAD
.026 BSC
INCHES
ALTERNATE
NOM
D2
28
INDEX
DETAIL
.024
.035
.001
.236
.146
.236
.146
.011
2
1
MAX
n
.039
.002
.240
.152
.240
.152
.013
.028
BOTTOM VIEW
SEE DETAIL
E2
MIN
0.80
0.00
5.90
3.55
5.90
3.55
0.23
0.50
 2004 Microchip Technology Inc.
MILLIMETERS*
0.65 BSC
0.20 REF
NOM
28
Revised 05-24-04
L
0.90
0.02
6.00
3.70
6.00
3.70
0.28
0.60
b
e
MAX
1.00
0.05
6.10
3.85
6.10
3.85
0.33
0.70

Related parts for PIC16F767-E/ML