MT48LC16M8A2TG-75:G Micron Technology Inc, MT48LC16M8A2TG-75:G Datasheet - Page 72

• Manufacturer Part Number: MT48LC16M8A2TG-75:G
• Description: DRAM Chip SDRAM 128M-Bit 16Mx8 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M8A2TG-75:G

• Package: 54TSOP-II
• Density: 128 Mb
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C

Package Dimensions
Figure 56:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
0.15
2X R 0.75
2X R 1.00
PIN #1 ID
+0.03
-0.02
54-Pin Plastic TSOP (400 mil)
Notes:
10.16 ±0.08
11.76 ±0.20
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. “2X” means the notch is present in two locations (both ends of the device).
0.25mm per side.
2.80
2X 0.10
2X 0.71
SEE DETAIL A
22.22 ±.08
72
0.10
+0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
-0.05
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn
PLASTIC PACKAGE MATERIAL: EPOXY NOVOLAC
PACKAGE WIDTH AND LENGTH DO NOT
INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
1.2 MAX
0.10
0.375 ±0.075 TYP
0.80 TYP
(FOR REFERENCE
ONLY)
0.50 ±0.10
128Mb: x4, x8, x16 SDRAM
DETAIL A
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
GAGE PLANE
0.80
0.25