PIC18F85J50T-I/PT Microchip Technology, PIC18F85J50T-I/PT Datasheet - Page 276
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PIC18F85J50T-I/PT
Manufacturer Part Number
PIC18F85J50T-I/PT
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,TQFP,64PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F65J50-IPT.pdf
(480 pages)
3.PIC18F65J50-IPT.pdf
(16 pages)
Specifications of PIC18F85J50T-I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
65
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3904 B
Interface Type
I2C, MSSP, SPI, EUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
65
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183022, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162087 - HEADER MPLAB ICD2 18F87J50 68/84MA180021 - MODULE PLUG-IN 18F87J50 FS USBAC164328 - MODULE SKT FOR 80TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC18F85J50T-I/PTTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F85J50T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- Current page: 276 of 480
- Download datasheet (8Mb)
PIC18F87J50 FAMILY
19.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDAx and the pin is allowed
to float high, the BRG is loaded with SSPxADD<6:0>
and counts down to 0. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
FIGURE 19-31:
FIGURE 19-32:
DS39775C-page 276
A low level is sampled on SDAx when SCLx
goes from a low level to a high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, see
Figure 19-31). If SDAx is sampled high, the BRG is
reloaded and begins counting. If SDAx goes from
high-to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDAx at
exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition (see Figure 19-32).
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCLx pin, the SCLx pin is
driven low and the Repeated Start condition is complete.
Cleared in software
T
BRG
© 2009 Microchip Technology Inc.
Interrupt cleared
in software
‘0’
‘0’
‘0’
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