NAND256W3A2BN6F NUMONYX, NAND256W3A2BN6F Datasheet - Page 51

• Manufacturer Part Number: NAND256W3A2BN6F
• Manufacturer: NUMONYX

Specifications of NAND256W3A2BN6F

• Cell Type: NAND
• Density: 256Mb
• Access Time (max): 12us
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 25b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 32M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Compliant

NAND128-A, NAND256-A
11
Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
RoHS compliant specifications are available at www.numonyx.com.
Figure 36. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline
1. Drawing is not to scale.
Table 21.
Symbol
CP
A1
A2
D1
E1
L1
A
B
C
E
e
L
a
D1
DIE
24
1
TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package
mechanical data
12.00
20.00
18.40
0.10
1.00
0.22
0.50
0.60
0.80
Typ
3°
E1
Millimeters
E
11.90
19.80
18.30
0.05
0.95
0.17
0.10
0.50
Min
0°
–
12.10
20.20
18.50
Max
1.20
0.15
1.05
0.27
0.21
0.08
0.70
5°
–
48
25
C
B
e
CP
A2
0.004
0.039
0.009
0.472
0.787
0.724
0.020
0.024
0.031
Typ
3°
A1
Inches
0.002
0.037
0.007
0.004
0.468
0.779
0.720
0.020
Package mechanical
Min
L1
0°
–
L
TSOP-G
A
0.047
0.006
0.041
0.011
0.008
0.003
0.476
0.795
0.728
0.028
Max
5°
–
51/59