MC13892JVLR2 Freescale, MC13892JVLR2 Datasheet - Page 86

• Manufacturer Part Number: MC13892JVLR2
• Manufacturer: Freescale

Specifications of MC13892JVLR2

• Operating Temperature (max): 85C
• Operating Temperature (min): -30C
• Mounting: Surface Mount
• Package Type: BGA
• Case Length: 12mm
• Screening Level: Commercial
• Lead Free Status / RoHS Status: Compliant

FUNCTIONAL DEVICE OPERATION
SUPPLIES
with a dual camera, it is anticipated that only one of the two cameras is active at a time, allowing the VCAM supply to be shared
between them.
resolution cameras, an external PNP is provided. The external PNP configuration is offered to avoid excess on-chip power
dissipation at high loads, and large differential between BP and output settings. For lower current requirements, an integrated
PMOS pass FET is included. The input pin for the integrated PMOS option is shared with the base current drive pin for the PNP
option. The external PNP configuration must be committed as a hardwired board level implementation, while the operating mode
is selected through the VCAMCONFIG bit after startup. The VCAM is not automatically enabled during the power up sequence,
allowing software to properly set the VCAMCONFIG bit before the regulator is activated. The recommended PNP device is the
ON Semiconductor NSS12100XV6T1G which is capable of handling up to 250 mW of continuous dissipation at a minimum
footprint and 75 °C of ambient. For use cases where up to 500 mW of dissipation is required, the recommended PNP device is
the ON Semiconductor NSS12100UW3TCG. For stability reasons a small minimum ESR may be required.
MULTI-MEDIA CARD SUPPLY
and the like. An external PNP is utilized for this LDO to avoid excess on-chip power dissipation at high loads and large differential
between BP and output settings. The external PNP device is always connected to the BP line in the application. VSD may also
be applied to other system needs within the guidelines of the regulator specifications. The recommended PNP device is the ON
Semiconductor NSS12100XV6T1G, which is capable of handling up to 250 mW of continuous dissipation at a minimum footprint
and 75 °C of ambient. For use cases where up to 500 mW of dissipation is required, the recommended PNP device is the ON
Semiconductor NSS12100UW3TCG. For stability reasons a small minimum ESR may be required. At the 1.8 V set point, the
VSD regulator can be powered from an external buck switcher (2.2 V typ) for an efficiency advantage and reduced power
dissipation in the pass devices.
GEN1, GEN2, AND GEN3 REGULATORS
devices, which could include WLAN, BT, GPS, or other functional modules. All the regulators include programmable set points
for system flexibility. At the 1.2 V and 1.5 V set points, both VGEN1 and VGEN2 can be powered from an external buck switcher
(2.2 V typ) for an efficiency advantage, and reduced power dissipation in the pass devices. (Note that a connection to BP or the
external buck switcher as the input to the regulators is a hardwired board level commitment, and not changed on-the-fly).
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VCAM has an internal PMOS pass FET which will support up to 2 Mpixel Camera modules (<65 mA). To support higher
The input VINCAM should always be connected to BP, even if the VCAM regulator is not used by the system.
This supply domain is generally intended for user accessible multi-media cards, such as Micro-SD (TransFlash), RS-MMC,
General purpose LDOs VGEN1, VGEN2, and VGEN3 are provided for expansion of the power tree to support peripheral
Table 56. VCAM Voltage Control
Table 57. VSD Voltage Control
VCAM[1:0]
Parameter
VSD[2:0]
Parameter
Value
00
01
10
11
Value
000
001
010
011
100
101
110
111
Output Voltage
2.75 V
3.00 V
2.5 V
2.6 V
Output Voltage
1.80 V
2.00 V
2.60 V
2.70 V
2.80 V
2.90 V
3.00 V
3.15 V
Internal Pass FET
VCAMCONFIG=0
65 mA
65 mA
65 mA
65 mA
ILoad max
250 mA
250 mA
250 mA
250 mA
250 mA
250 mA
250 mA
250 mA
ILoad max
BP or External Switcher
Analog Integrated Circuit Device Data
VCAMCONFIG=1
Input Supply
External PNP
250 mA
250 mA
250 mA
250 mA
BP
BP
BP
BP
BP
BP
BP
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