ICS85105AGILF IDT, Integrated Device Technology Inc, ICS85105AGILF Datasheet - Page 12

• Manufacturer Part Number: ICS85105AGILF
• Description: IC FANOUT BUFFER HCSL 20-TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Buffer (Distribution), Multiplexerr

Specifications of ICS85105AGILF

• Number Of Circuits: 1
• Ratio - Input:output: 2:5
• Differential - Input:output: Yes/Yes
• Input: HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL
• Output: HCSL
• Frequency - Max: 500MHz
• Voltage - Supply: 2.97 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Frequency-max: 500MHz
• Number Of Clock Inputs: 2
• Output Frequency: 500MHz
• Output Logic Level: HCSL
• Operating Supply Voltage (min): 2.97V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.63V
• Package Type: TSSOP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1152; 800-1152-5; 800-1152; 85105AGILF

This section provides information on power dissipation and junction temperature for the ICS85105I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85105I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
flow and a multi-layer board, the appropriate value is 91.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS85105I
LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER
™
/ ICS
6. T
Multi-Layer PCB, JEDEC Standard Test Boards
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 5 * 47.3mW = 236.5mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
85°C + 0.335W * 91.1°C/W = 115.5°C. This is below the limit of 125°C.
™
JA
A
0.7V HCSL FANOUT BUFFER
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
MAX
ESISTANCE
_MAX
= V
MAX
(3.63V, with all outputs switching) = 98.01mW + 236.5mW = 334.51mW
= 47.3mW/Loaded Output pair
DD_MAX
* I
JA
DD_MAX
FOR
= 3.63V * 27mA = 98.01mW
20-L
DD
= 3.3V + 10% = 3.63V, which gives worst case results.
P
EADN
JA
by Velocity (Meters per Second)
OWER
JA
* Pd_total + T
TSSOP, F
C
ORCED
ONSIDERATIONS
A
12
91.1°C/W
C
0
ONVECTION
TM
devices is 125°C.
86.7°C/W
1
JA
ICS85105AGI REV. A JUNE 5, 2008
must be used. Assuming no air
84.6°C/W
2.5