MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 20

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

20
C5NP
CHAPTER 1: FUNCTIONAL DESCRIPTION
•
•
•
•
•
•
High functional integration
•
•
•
•
•
•
Stable programming interfaces
•
•
Third-party support
•
•
More than 3,000MIPs of computing power (for adding services throughout the
protocol stack)
Up to 15 million packets per second transmitted at wire speed
17 programmable RISC Cores (for cell/packet forwarding)
32 programmable Serial Data Processors (for processing bit streams)
Up to 133 million table lookups per second
Three internal buses for 60Gb of aggregate bandwidth
838 pin Ball Grid Array (BGA) package
16 Channel Processors including:
– Embedded OC-3c, OC-12, OC-12c SONET framers
– Programmable MAC interface
– RISC Cores
– Programmable pin PHY interfaces
Embedded coprocessors for table lookup (classification), buffer memory (payload
control), and queue management (CoS/QoS implementation)
Dedicated Fabric Processor and port
Embedded RISC Executive Processor
Integrated 32bit/66MHz PCI bus
Supports generic communications programming interfaces to simplify programming
and allow future reuse of code across generations of the processor
Network Processing Forum (NPF), (formerly CPIX), Charter member
Support for virtually any third-party protocol stack, PHY or fabric interface, and
industry standard tools
Smart Networks Alliance Program ensures a wide range of verified solutions