MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 94

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

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C5NP
CHAPTER 4: MECHANICAL SPECIFICATIONS
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
make a difference for marginally solderable PC board pads.
be used.