LAN8700IC-AEZG SMSC, LAN8700IC-AEZG Datasheet - Page 75

• Manufacturer Part Number: LAN8700IC-AEZG
• Description: TXRX ETHERNET 10/100 IND 36-QFN
• Manufacturer: SMSC
• Type: Transceiverr

Specifications of LAN8700IC-AEZG

• Protocol: MII, RMII
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 36-QFN
• Supply Voltage Range: 3V To 3.6V
• Digital Ic Case Style: QFN
• No. Of Pins: 36
• Operating Temperature Range: -40°C To +85°C
• Control Interface: MII, RMII
• Data Rate Max: 100Mbps
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Drivers/receivers: -
• Other names: 638-1047-6

±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR
Datasheet
Chapter 9 Package Outline, Tape and Reel
SMSC LAN8700/LAN8700i
ccc
A1
A2
A3
D2
E1
E2
D1
A
D
E
L
e
b
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
0.80
0.60
5.85
5.55
3.55
5.85
5.55
3.55
0.35
0.18
MIN
~
0
terminal tip. Tolerance on the true position of the terminal is ± 0.05 mm at maximum material
conditions (MMC).
Figure 9.1 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)
0.50 Basic
NOMINAL
0.20 REF
~
~
~
~
~
~
~
~
~
~
~
~
Table 9.1 36-Pin QFN Package Parameters
MAX
1.00
0.05
0.80
6.15
5.95
3.85
6.15
5.95
3.85
0.75
0.30
0.08
DATASHEET
®
75
Technology in a Small Footprint
Copper Lead-frame Substrate
Overall Package Height
X exposed Pad Size
Y exposed Pad Size
X Mold Cap Size
Y Mold Cap Size
Terminal Length
Mold Thickness
Terminal Width
X Overall Size
Y Overall Size
Terminal Pitch
REMARKS
Coplanarity
Standoff
Revision 2.2 (12-04-09)