TE28F256J3C125 Intel, TE28F256J3C125 Datasheet - Page 11
TE28F256J3C125
Manufacturer Part Number
TE28F256J3C125
Description
Manufacturer
Intel
Datasheet
1.TE28F256J3C125.pdf
(72 pages)
Specifications of TE28F256J3C125
Cell Type
NOR
Density
256Mb
Access Time (max)
125ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25/24Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
32M/16M
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F256J3C125
Manufacturer:
INTEL
Quantity:
5 510
Company:
Part Number:
TE28F256J3C125
Manufacturer:
TSOP
Quantity:
4 800
Company:
Part Number:
TE28F256J3C125SL7HD
Manufacturer:
SANREX
Quantity:
210
3.0
3.1
Datasheet
Package Height
Standoff
Package Body Thickness
Lead Width
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
Terminal Dimension
Lead Tip Length
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Figure 3. 56-Lead TSOP Package Drawing and Specifications
Table 1. 56-Lead TSOP Dimension Table
Package Information
56-Lead TSOP Package
Pin 1
Z
Detail A
Sym
D
A
A
∅
A
E
D
N
Y
b
c
e
L
Z
1
2
1
See Detail A
See Notes 1 and 3
18.200
13.800
19.800
0.050
0.965
0.100
0.100
0.500
0.150
Min
0°
L
D
D
1
C
18.400
14.000
0
0.995
0.150
0.150
0.500
20.00
0.600
0.250
Nom
56
3°
Millimeters
See Note 2
18.600
14.200
20.200
1.200
1.025
0.200
0.200
0.700
0.100
0.350
b
Max
5°
Detail B
A
E
Notes
4
4
A
2
0.002
0.038
0.004
0.004
0.717
0.543
0.780
0.020
0.006
Min
0°
Seating
Plane
A
See Detail B
e
1
Y
0.0197
0.039
0.006
0.006
0.724
0.551
0.787
0.024
0.010
Nom
56
3°
256-Mbit J3 (x8/x16)
Inches
0.047
0.040
0.008
0.008
0.732
0.559
0.795
0.028
0.004
0.014
Max
5°
Notes
4
4
11