SI3050-KT Silicon Laboratories Inc, SI3050-KT Datasheet - Page 104

IC VOICE DAA GCI/PCM/SPI 20TSSOP

SI3050-KT

Manufacturer Part Number
SI3050-KT
Description
IC VOICE DAA GCI/PCM/SPI 20TSSOP
Manufacturer
Silicon Laboratories Inc
Type
Chipsetr
Datasheets

Specifications of SI3050-KT

Package / Case
20-TSSOP
Function
Data Access Arrangement (DAA)
Interface
PCM, Serial, SPI
Number Of Circuits
1
Voltage - Supply
3 V ~ 3.6 V
Current - Supply
8.5mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Includes
Line Voltage Monitor, Loop Current Monitor, Overload Detection, Parallel Handset Detection, Polarity Reversal Detection, TIP and
Product
Modem Chip
Supply Voltage (min)
3 V
Supply Current
8.5 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Power (watts)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI3050-KT
Manufacturer:
SILICONIX
Quantity:
20 000
Part Number:
SI3050-KTR
Manufacturer:
NEC
Quantity:
947
Part Number:
SI3050-KTR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Company:
Part Number:
SI3050-KTR
Quantity:
2 278
Si3050
Package Outline: 20-Pin TSSOP
Figure 49 illustrates the package details for the Si3050. Table 27 lists the values for the dimensions shown in the
illustration.
104
Figure 49. 20-Pin Thin Shrink Small Outline Package (TSSOP)
γ
D
Table 27. Package Diagram Dimensions
*Note: Typical parameters are for information
Symbol
A1
A
B
C
D
E
H
e
L
θ
γ
purposes only.
B
e
0.05
0.19
0.09
4.30
0.45
Min
6.4
E
Millimeters
6.40 BSC
.65 BSC
A1
Rev. 1.0
H
A
Max
0.15
0.30
0.20
4.50
0.75
0.10
1.2
6.6
θ
Approximate device weight is 115.7 mg.
Typical*
!
!
!
!
L
C

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