SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 13

• Manufacturer Part Number: SAM9M10
• Manufacturer: Atmel Corporation

Specifications of SAM9M10

• Flash (kbytes): 0 Kbytes
• Pin Count: 324
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 160
• Ext Interrupts: 160
• Usb Transceiver: 3
• Usb Speed: Hi-Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 5
• Lin: 4
• Ssc: 2
• Ethernet: 1
• Sd / Emmc: 2
• Graphic Lcd: Yes
• Video Decoder: Yes
• Camera Interface: Yes
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 440
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 2
• Dram Memory: DDR2/LPDDR, SDRAM/LPSDR
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

List of Figures
ARM7TDMI Technical Reference Manual
ARM DDI 0029G
Figure P-1
Figure 1-1
Figure 1-2
Figure 1-3
Figure 1-4
Figure 1-5
Figure 1-6
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 3-8
Figure 3-9
Figure 3-10
Key to timing diagram conventions ............................................................................. xx
Instruction pipeline .................................................................................................... 1-3
ARM7TDMI processor block diagram ....................................................................... 1-7
Main processor .......................................................................................................... 1-8
ARM7TDMI processor functional diagram ................................................................ 1-9
ARM instruction set formats .................................................................................... 1-11
Thumb instruction set formats ................................................................................. 1-20
LIttle-endian addresses of bytes and halfwords within words ................................... 2-4
Big-endian addresses of bytes and halfwords within words ...................................... 2-5
Register organization in ARM state ........................................................................... 2-9
Register organization in Thumb state ..................................................................... 2-10
Mapping of Thumb-state registers onto ARM-state registers .................................. 2-11
Program status register format ................................................................................ 2-13
Simple memory cycle ................................................................................................ 3-4
Nonsequential memory cycle .................................................................................... 3-6
Sequential access cycles .......................................................................................... 3-7
Internal cycles ........................................................................................................... 3-8
Merged IS cycle ........................................................................................................ 3-9
Coprocessor register transfer cycles ....................................................................... 3-10
Memory cycle timing ............................................................................................... 3-10
Pipelined addresses ................................................................................................ 3-14
Depipelined addresses ............................................................................................ 3-15
SRAM compatible address timing ........................................................................... 3-16
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