AD9122 Analog Devices, AD9122 Datasheet - Page 8

• Manufacturer Part Number: AD9122
• Manufacturer: Analog Devices

Specifications of AD9122

• Resolution (bits): 16bit
• Dac Update Rate: 1.23GSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +3.47V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: LVDS,Par

AD9122
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33 to AVSS, EPAD, CVSS, DVSS
IOVDD to AVSS, EPAD, CVSS, DVSS
DVDD18, CVDD18 to AVSS, EPAD,
AVSS to EPAD, CVSS, DVSS
EPAD to AVSS, CVSS, DVSS
CVSS to AVSS, EPAD, DVSS
DVSS to AVSS, EPAD, CVSS
FSADJ, REFIO, IOUT1P, IOUT1N,
D[15:0]P, D[15:0]N, FRAMEP, FRAMEN,
DACCLKP, DACCLKN, REFCLKP,
RESET, IRQ, CS, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
CVSS, DVSS
IOUT2P, IOUT2N to AVSS
DCIP, DCIN to EPAD, DVSS
REFCLKN to CVSS
to EPAD, DVSS
−0.3 V to +3.6 V
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to IOVDD + 0.3 V
125°C
−65°C to +150°C
Rev. B | Page 8 of 60
THERMAL RESISTANCE
The exposed pad (EPAD) of the 72-lead LFCSP must be
soldered to the ground plane (AVSS). The EPAD provides an
electrical, thermal, and mechanical connection to the board.
Typical θ
still air. Airflow increases heat dissipation, effectively reducing
θ
Table 7. Thermal Resistance
Package
72-Lead LFCSP
ESD CAUTION
JA
and θ
JB
JA
.
, θ
JB
, and θ
θ
20.7
JA
JC
values are specified for a 4-layer board in
θ
10.9
JB
θ
1.1
JC
Unit
°C/W
Conditions
EPAD soldered
to ground plane