BUK463-60A Philips Semiconductors, BUK463-60A Datasheet
BUK463-60A
Related parts for BUK463-60A
BUK463-60A Summary of contents
Page 1
... CONDITIONS MIN ˚ 100 ˚ ˚ ˚ CONDITIONS - minimum footprint, FR4 board (see Fig. 18). 1 Product Specification BUK463-60A/B MAX. MAX. UNIT -60A -60B 175 175 0.08 0.10 SYMBOL MAX. UNIT - ...
Page 2
... CONDITIONS - - -dI /dt = 100 CONDITIONS Product Specification BUK463-60A/B MIN. TYP. MAX. UNIT 2.1 3.0 4 0.1 1 100 nA - 0.07 0.08 - 0.08 0.10 MIN. ...
Page 3
... Fig.5. Typical output characteristics BUK453-60 0.5 0.4 0 0.2 100 0 100 ms 0 100 = 25 ˚C Fig.6. Typical on-state resistance Product Specification BUK463-60A/B Zth j-mb / (K/W) ZTHX53 0.5 0.2 0 1E-07 1E-05 1E-03 1E- Fig.4. Transient thermal impedance f(t); parameter j- ...
Page 4
... 10000 1000 100 100 140 180 Fig.12. Typical capacitances f Product Specification BUK463-60A/B VGS(TO max. typ. min. - 100 140 Fig.10. Gate threshold voltage. = f(T ); conditions mA SUB-THRESHOLD CONDUCTION 2 % typ ...
Page 5
... VDS / V =10 100 Fig.15. Normalised avalanche energy rating. DS BUK453-50A VGS Fig.16. Avalanche energy test circuit Product Specification BUK463-60A/B WDSS 100 120 140 160 Tmb / f(T ); conditions DSS VDS - T.U. RGS shunt ...
Page 6
... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Epoxy meets UL94 V0 at 1/8". July 1995 10.3 max 11 max 15.4 0.85 max (x2) Fig.17. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.18. SOT404 : soldering pattern for surface mounting . 6 Product Specification BUK463-60A/B 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...
Page 7
... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1995 7 Product Specification BUK463-60A/B Rev 1.000 ...