M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet
M24C01-x
Related parts for M24C01-x
M24C01-x Summary of contents
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... M24C08-x M24C04-x M24C02-x M24C01-x 8-Kbit, 4-Kbit, 2-Kbit, and 1-Kbit serial I²C bus EEPROM Features ■ Supports both the 100 kHz I 2 and the 400 kHz I C Fast-mode ■ Single supply voltage: – 2 5.5 V for M24Cxx-W – 1 5.5 V for M24Cxx – 1 5.5 V for M24Cxx-F ■ ...
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... Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.7.1 3.7.2 3.7.3 3.7.4 4 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/37 M24C08-x M24C04-x M24C02-x M24C01-x Write Control (WC Operating supply voltage Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 15 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current Address Read ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Doc ID 5067 Rev 18 Contents 3/37 ...
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... TSSOP8 – 8 lead thin shrink small outline, package mechanical data Table 21. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data Table 22. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 23. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4/37 M24C08-x M24C04-x M24C02-x M24C01 Fast mode) (M24Cxx- Standard mode) (M24Cxx-W, Doc ID 5067 Rev 18 ...
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... M24C08-x M24C04-x M24C02-x M24C01-x List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections (top view Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside Figure 4. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Figure Fast mode (f C capacitance (C bus Figure 6. I² ...
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... Description 1 Description These I²C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 1024/512/256/128 x 8 (M24C08-x, M24C04-x, M24C02-x and M24C01-x). Figure 1. Logic diagram I²C uses a two-wire serial interface, comprising a bidirectional data line and a clock line. The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the I²C bus definition. The device behaves as a slave in the I² ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Figure 2. 8-pin package connections (top view Not connected 2. See Section 7: Package mechanical data 3. The Ei inputs are not decoded, and are therefore decoded as “0” (See E2) for more information). Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside) 1 ...
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... Write operations are allowed. When Write Control (WC) is driven High, device select and address bytes are acknowledged, data bytes are not acknowledged. 8/37 M24C08-x M24C04-x M24C02-x M24C01-x indicates how the value of the pull-up resistor can be calculated). In Figure 4. When not connected (left floating), Ei inputs are ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 2.4 Supply voltage (V 2.4.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V in Section 6: DC and AC recommended to decouple the 100 nF) close to the V This voltage must remain stable and valid until the end of the transmission of the instruction and, for a Write instruction, until the completion of the internal write cycle (t 2 ...
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... Signal description 2 Figure Fast mode (f capacitance (C Figure 6. I²C bus protocol SCL SDA SCL SDA Start condition SCL SDA 10/37 M24C08-x M24C04-x M24C02-x M24C01-x = 400 kHz): maximum Rbus value versus bus parasitic C ) bus SDA SDA Start Input Change condition MSB 1 2 ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 3 Device operation The device supports the I²C protocol. This is summarized in data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device ...
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... Standby mode. Table 4. Operating modes Mode Current Address Read Random Address Read Sequential Read Byte Write Page Write 12/37 M24C08-x M24C04-x M24C02-x M24C01-x (1) Device type identifier ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 3.6 Write operations Following a Start condition the bus master sends a device select code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in address byte. The device responds to the address byte with an acknowledge bit, and then waits for the data byte. ...
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... After each byte is transferred, the internal byte address counter (the 4 least significant address bits only) is incremented. The transfer is terminated by the bus master generating a Stop condition. 14/37 M24C08-x M24C04-x M24C02-x M24C01-x Figure Doc ID 5067 Rev 18 7, and the location is not ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Figure 8. Write mode sequences with (data write enabled) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 3.6.3 Minimizing system delays by polling on ACK During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells ...
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... Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the contents of the addressed byte. The bus master must not acknowledge the byte, and terminates the transfer with a Stop condition. 16/37 M24C08-x M24C04-x M24C02-x M24C01-x Write cycle in progress Start condition ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 3.7.2 Current Address Read For the Current Address Read operation, following a Start condition, the bus master only sends a device select code with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the byte addressed by the internal address counter. The counter is then incremented ...
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... Address Read Sequentila Current Read Sequential Random Read 1. The seven most significant bits of the device select code of a Random Read (in the 1 be identical. 18/37 M24C08-x M24C04-x M24C02-x M24C01-x ACK NO ACK Dev select Data out R/W ACK ACK Dev select * Byte address Dev select * ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 4 Initial delivery state The device is delivered with all bits in the memory array set to 1 (each byte contains FFh). 5 Maximum rating Stressing the device outside the ratings listed in the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operating sections of this specification, is not implied ...
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... Ambient operating temperature Table 7. Operating conditions (M24Cxx-R) Symbol V Supply voltage CC Ambient operating temperature Table 8. Operating conditions (M24Cxx-F) Symbol V Supply voltage CC Ambient operating temperature 20/37 M24C08-x M24C04-x M24C02-x M24C01-x Parameter Parameter Parameter Doc ID 5067 Rev 18 Min. Max. Unit 2.5 5.5 V –40 85 °C Min. Max. Unit 1 ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Table 9. DC characteristics (M24Cxx-W, device grade 6) Symbol Parameter Input leakage current I LI (SCL, SDA, E0, E1,and E2) I Output leakage current LO I Supply current CC I Standby supply current CC1 Input low voltage (SDA SCL, WC) Input high voltage (SDA, ...
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... Table 12. AC measurement conditions Symbol C Load capacitance bus SCL input rise/fall time, SDA input fall time Input levels Input and output timing reference levels Figure 11. AC measurement I/O waveform 22/37 M24C08-x M24C04-x M24C02-x M24C01-x Test condition (in addition to those device in Standby mode ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Table 13. Input parameters Symbol Parameter C Input capacitance (SDA Input capacitance (other pins input impedance WCL Z WC input impedance WCH Pulse width ignored (input filter on SCL t NS and SDA) 1. Characterized only. Table 14. AC characteristics at 400 kHz (I ...
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... Fast mode) (M24Cxx-W, M24Cxx-R, 2. Characterized only avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 4. For a reStart condition, or following a Write cycle. 24/37 M24C08-x M24C04-x M24C02-x M24C01 Standard mode) Section 6: DC and AC parameters Parameter Clock frequency ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Figure 12. AC waveforms Doc ID 5067 Rev 18 DC and AC parameters 25/37 ...
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... M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data Symbol ( Values in inches are converted from mm and rounded to 4 decimal digits the total number of terminals. 26/37 M24C08-x M24C04-x M24C02-x M24C01 SEATING PLANE millimeters Typ ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Table 17. M24C08: Thin WLCSP (0.3 mm height), 0.4 mm pitch, 5 bumps, package data Symbol ( Preliminary data. 2. Values in inches are converted from mm and rounded to 4 decimal digits the total number of terminals. (1) millimeters Typ Min Max 0 ...
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... SO8 narrow – 8 lead plastic small outline, 150 mils body width, package mechanical data Symbol ccc Values in inches are converted from mm and rounded to 4 decimal digits. 28/37 M24C08-x M24C04-x M24C02-x M24C01-x A ccc millimeters Typ Min Max - - 1.750 - 0.100 ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead mm, outline 1. Drawing is not to scale. 2. The central pad (the area the above illustration) is pulled, internally allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process ...
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... Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol Values in inches are converted from mm and rounded to 4 decimal digits. 30/37 M24C08-x M24C04-x M24C02-x M24C01 millimeters Typ. Min. Max ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Figure 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline 1. Drawing is not to scale. Table 21. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data Symbol Values in inches are converted from mm and rounded to 4 decimal digits. ...
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... Only M24C08-x and Root Part Number 1 devices are offered in the WLCSP package. 2. Only M24C08-x-F devices are offered in the Thin WLCSP package. For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST sales office. 32/37 M24C08-x M24C04-x M24C02-x M24C01-x M24C01 (2) (Chip scale package) Doc ID 5067 Rev 18 – ...
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... M24C08-x M24C04-x M24C02-x M24C01-x 9 Revision history Table 23. Document revision history Date Version 10-Dec-1999 2.4 18-Apr-2000 2.5 05-May-2000 2.6 23-Nov-2000 3.0 19-Feb-2001 3.1 20-Apr-2001 3.2 08-Oct-2001 3.3 09-Nov-2001 3.4 30-Jul-2002 3.5 04-Feb-2003 3.6 05-May-2003 3.7 07-Oct-2003 4.0 17-Mar-2004 5.0 Changes TSSOP8 Turned-Die package removed (p 2 and order information) Lead temperature added for TSSOP8 in table 2 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for ...
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... Revision history Date Version 7-Oct-2005 6.0 17-Jan-2006 7.0 19-Sep-2006 03-Aug-2007 27-Sep-2007 34/37 M24C08-x M24C04-x M24C02-x M24C01-x Product List summary table added. AEC-Q100-002 compliance. Device Grade information clarified. Updated Figure 4, Figure 5, Table 16 Updated tW=5ms for the M24Cxx-W. Pin numbers removed from silhouettes (see on page 1). Reset paragraph moved to below Section 2 ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Date Version 30-Jan-2009 11-Mar-2009 28-May-2009 02-Mar-2010 01-Apr-2010 Section 2.4: Supply voltage (VCC) Figure 5: I2C Fast mode (fC = 400 kHz): maximum Rbus value versus bus parasitic capacitance (Cbus) I added to Table 5: Absolute maximum OL clarified in DC characteristics Note modified below Table 13: Input ...
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... Revision history Date Version 29-Apr-2010 15-Apr-2011 27-Jul-2012 36/37 M24C08-x M24C04-x M24C02-x M24C01-x Deleted TSSOP8 3x3 mm package from cover page. Deleted Figure and Table relating to TSSOP8 3x3 mm package information. Deleted line and note in Table 22: Ordering information scheme TSSOP8 3x3 mm package. In Table 26: Available M24C08 products (package, voltage range, ...
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... M24C08-x M24C04-x M24C02-x M24C01-x Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...