M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet - Page 36

• Manufacturer Part Number: M24C01-x
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Revision history
36/37
29-Apr-2010
15-Apr-2011
27-Jul-2012
Date
Version
16
17
18
Deleted TSSOP8 3x3 mm package from cover page.
Deleted Figure and Table relating to TSSOP8 3x3 mm package
information.
Deleted line and note in
TSSOP8 3x3 mm package.
In
temperature grade)
to 5 and deleted line concerning TSSOP8 3x3 mm package.
In
temperature grade)
to 5.
In
temperature grade)
Updated:
- Text modified in
- Text modified in
- V
-
no lead 2 x 3 mm,
- E2 (Rev MC): “ddd” has been changed to “eee” and its values modified in
Table 19: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no
lead 2 x 3 mm,
Added:
- Note at the end of the
- Figure footnote below the
(top view, marking side, with balls on the
Removed M24C16-x and M24xxx range 3 devices.
M24C01-F and M24C02-F RPNs removed from
Figure 15: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package
Table 26: Available M24C08 products (package, voltage range,
Table 27: Available M24C04 products (package, voltage range,
Table 28: Available M24C02 products (package, voltage range,
ESD
minimum value deleted
Doc ID 5067 Rev 18
data.
Section 2.3: Chip Enable (E0, E1,
Section 3.6: Write
outline.
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDFPN8 (MC) package for M24C08-F range
updated UFDRPN8 options to MB or MC.
Table 22: Ordering information scheme
Section 1:
M24C08-x M24C04-x M24C02-x M24C01-x
Figure 3: WLCSP and thin WLCSP connections
ofTable 5: Absolute maximum
Changes
Description.
operations.
underside).
Table 1: Device
E2).
ratings.
concerning
summary.