M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet - Page 26

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M24C01-x

Manufacturer Part Number
M24C01-x
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package mechanical data
7
26/37
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 13. WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,
1. Drawing is not to scale.
Table 16.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. N is the total number of terminals.
Symbol
N
A1
A2
e1
e2
G
A
D
E
b
e
F
(2)
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
M24C08: WLCSP (0.5 mm height) 0.4 mm pitch, 5 bumps, package data
package outline
0.545
0.190
0.355
0.270
1.215
1.025
0.400
0.693
0.346
0.313
0.261
Typ
millimeters
E
A
0.495
0.165
0.330
0.240
1.195
1.005
Doc ID 5067 Rev 18
Min
5
A2
-
-
-
-
-
A1
A
B
C
b
1
e2
D
e1
2
0.595
0.215
0.380
0.300
1.235
1.045
SEATING PLANE
Max
3
-
-
-
-
-
M24C08-x M24C04-x M24C02-x M24C01-x
G
F
e
Orientation reference
0.0215
0.0075
0.0140
0.0106
0.0478
0.0404
0.0157
0.0273
0.0136
0.0123
0.0103
Typ
1Ca_ME
inches
0.0195
0.0065
0.0130
0.0094
0.0470
0.0396
Min
5
-
-
-
-
-
(1)
0.0234
0.0085
0.0150
0.0118
0.0486
0.0411
Max
-
-
-
-
-
®

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