K4T56163QI-ZCLCC SAMSUNG [Samsung semiconductor], K4T56163QI-ZCLCC Datasheet - Page 5

• Manufacturer Part Number: K4T56163QI-ZCLCC
• Description: 256Mb I-die DDR2 SDRAM Specification
• Manufacturer: SAMSUNG [Samsung semiconductor]

3.0 Package Pinout/Mechanical Dimension & Addressing
K4T56163QI
(See the balls through the Package)
Top View
Note :
1. VDDL and VSSDL are power and ground for the DLL.
2. In case of only 8 DQs out of 16 DQs are used, LDQS, LDQSB and DQ0~7 must be used.
+ : Depopulated Ball
Ball Locations (x16)
: Populated Ball
3.1 x16 package pinout (Top View) : 84ball FBGA Package
VDDQ
VDDQ
DQ14
DQ12
VDDL
VDD
VDD
DQ6
DQ4
VDD
VSS
NC
1
A10/AP
VSSQ
VSSQ
VSSQ
VSSQ
VREF
DQ9
DQ1
CKE
BA0
A12
NC
NC
A3
A7
2
VDDQ
VDDQ
DQ11
UDM
VSS
VSS
LDM
DQ3
VSS
BA1
WE
NC
A1
A5
A9
3
5 of 42
A
B
C
D
E
G
H
K
F
J
L
M
P
R
N
A
B
C
D
G
H
K
M
N
R
E
F
L
P
J
VSSDL
UDQS
VDDQ
DQ10
LDQS
VDDQ
VSSQ
VSSQ
DQ2
RAS
CAS
A11
NC
A2
A6
7
1
+
+
+
2
UDQS
VSSQ
VSSQ
LDQS
VSSQ
VSSQ
DQ8
DQ0
3
CK
CK
CS
NC
A0
A4
A8
8
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
4
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
5
VDDQ
VDDQ
VDDQ
VDDQ
DQ15
DQ13
DQ7
DQ5
VDD
ODT
VDD
VSS
9
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
6
7
Rev. 1.0 October 2007
8
DDR2 SDRAM
+
+
+
9