MAX11642EEG+T Maxim Integrated, MAX11642EEG+T Datasheet - Page 2

• Manufacturer Part Number: MAX11642EEG+T
• Description: Analog to Digital Converters - ADC 16Ch 8-Bit 300ksps w/FIFO & Int Ref
• Manufacturer: Maxim Integrated

Specifications of MAX11642EEG+T

• Rohs: yes
• Number Of Channels: 16/8
• Architecture: SAR
• Conversion Rate: 300 KSPs
• Resolution: 8 bit
• Input Type: Single-Ended/Differential
• Interface Type: SPI
• Operating Supply Voltage: 4.75 V to 5.25 V
• Maximum Power Dissipation: 762 mW
• Number Of Converters: 1
• Voltage Reference: 4.096 V

8-Bit, 16-/8-Channel, 300ksps ADCs
with FIFO and Internal Reference
PACKAGE THERMAL CHARACTERISTICS (Note 1)
16 QSOP
ABSOLUTE MAXIMUM RATINGS
V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (V
AIN0–AIN13, CNVST/AIN_,
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
4.8MHz (external clock 50% duty cycle), V
T
2
DC ACCURACY (Note 3)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Offset Error Temperature
Coefficient
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, f
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
MAX
DD
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
DD
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
REF to GND ...........................................-0.3V to (V
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
, unless otherwise noted. Typical values are at T
= +2.7V to +3.6V (MAX11639/MAX11643), V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= +70°C)
SYMBOL
SINAD
SFDR
JC
DNL
THD
RES
IMD
INL
)......................37°C/W
REF
JA
)...............105°C/W
= 2.5V (MAX11639/MAX11643), V
No missing codes over temperature
(Note 4)
Up to the 5th harmonic
f
-3dB point
S/(N + D) > 48dB
IN1
DD
DD
DD
A
= 29.9kHz, f
= +25°C.) (Note 2)
+ 0.3V)
+ 0.3V)
= +4.75V to +5.25V (MAX11638/MAX11642), f
CONDITIONS
IN2
SCLK
24 QSOP
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
= 30.1kHz
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
= 4.8MHz)
REF
= 4.096V (MAX11638/MAX11642), T
MIN
8
SAMPLE
±0.5
±0.5
±0.8
±0.1
TYP
100
-70
-72
-67
±2
49
1
JC
).......................34°C/W
JA
= 300kHz, f
)................88°C/W
MAX
±0.5
±0.5
±1
±1
A
= T
ppm/°C
ppm/°C
UNITS
SCLK
MHz
LSB
LSB
LSB
LSB
FSR
LSB
dBc
dBc
dBc
kHz
Bits
dB
MIN
to
=