DS21448A1 Maxim Integrated, DS21448A1 Datasheet - Page 60

• Manufacturer Part Number: DS21448A1
• Description: Network Controller & Processor ICs 3.3V E1/T1/J1 Quad Interface
• Manufacturer: Maxim Integrated

Specifications of DS21448A1

• Part # Aliases: 90-21448-0A1

13.
Table 13-A. Thermal Characteristics—BGA
Table 13-B. Theta-JA (θ
Table 13-C. Thermal Characteristics—LQFP
Table 13-D. Theta-JA (θ
Note 1: The package is mounted on a four-layer JEDEC-standard test board.
Note 2: Theta-JA (θ
Note 3: While Theta-JC (θ
Note 4: The method of measurement for the thermal parameters is defined in the EIA/JEDEC-standard document EIA-JESD51-2.
14.
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
M a x i m I n t e g r a t e d P r o d u c t s , 1 2 0 S a n G a b r i e l D r i v e , S u n n y v a l e , C A 9 4 0 8 6 4 0 8 - 7 3 7 - 7 6 0 0
Ambient Temperature (Note 1)
Junction Temperature
Theta-JA (θ
Ambient Temperature (Note 1)
Junction Temperature
Theta-JA (θ
Theta-JC (θ
REVISION
042303
012104
113004
011206
FORCED AIR (m/s)
FORCED AIR (m/s)
the average temperature on top center of the LQFP package (TC), the proper term is Psi-JT. It is defined by: (Tj - TC) / overall package
power.
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THERMAL INFORMATION
REVISION HISTORY
PARAMETER
PARAMETER
2.5
JA
JA
JC
2.5
0
1
0
1
) in Still Air (Note 2)
) in Still Air (Note 2)
) in Still Air (Note 3)
New product release.
Table 5-B. Receive Level Indication: Changed “-12.5 to -5.0” to “-12.5 to -15.0”. Adjusted steps
after -17.5 dB to be in -2.5dB decrements.
Section 9, Operating Parameters: Updated supply current and power dissipation values in the DC
Characteristics table to reflect latest characterization data. Updated Note 5 to show that values are for all ports
active.
In the Absolute Maximum Ratings section, added range for storage temperature and changed
soldering temperature from IPC JEDEC J-STD-020A to J-STD-020.
Added lead-free packages to Ordering Information table.
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC-standard test board.
JC
) is commonly used as the thermal parameter that provides a correlation between the junction temperature (Tj) and
JA
JA
) vs. Airflow—BGA
) vs. Airflow—LQFP
THETA-JA (θ
© 2006 Maxim Integrated Products • Printed USA
THETA-JA (θ
24°C/W
21°C/W
19°C/W
27.8°C/W
23.5°C/W
21.6°C/W
MIN
MIN
-40
-40
JA
JA
)
60 of 60
)
+27.8
TYP
TYP
+0.1
+24
DESCRIPTION
MAX
+125
MAX
+125
+85
+85
DS21448 3.3V T1/E1/J1 Quad Line Interface
UNITS
UNITS
°C/W
°C/W
°C/W
°C
°C
°C
°C