CY7C1512JV18-267BZI Cypress Semiconductor Corp, CY7C1512JV18-267BZI Datasheet

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CY7C1512JV18-267BZI

Manufacturer Part Number
CY7C1512JV18-267BZI
Description
IC SRAM 72MBIT 267MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1512JV18-267BZI

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
72M (4M x 18)
Speed
267MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1512JV18-267BZI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1512JV18-267BZIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Features
Selection Guide
Cypress Semiconductor Corporation
Document #: 001-14435 Rev. *G
Maximum Operating Frequency
Maximum Operating Current
Separate Independent Read and Write Data Ports
267 MHz Clock for High Bandwidth
2-word Burst on all Accesses
Double Data Rate (DDR) Interfaces on both Read and Write
Ports (data transferred at 534 MHz) at 267 MHz
Two Input Clocks (K and K) for Precise DDR Timing
Two Input Clocks for Output Data (C and C) to Minimize Clock
Skew and Flight Time Mismatches
Echo Clocks (CQ and CQ) Simplify Data Capture in High Speed
Systems
Single Multiplexed Address Input Bus Latches Address Inputs
for both Read and Write Ports
Separate Port Selects for Depth Expansion
Synchronous Internally Self-timed Writes
QDR
Lock Loop (DLL) is enabled
Operates like a QDR I Device with 1 Cycle Read Latency in
DLL Off Mode
Available in x9, x18, and x36 Configurations
Full Data Coherency, providing most current data
Core V
Available in 165-Ball FBGA Package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free Packages
Variable Drive HSTL Output Buffers
JTAG 1149.1 Compatible Test Access Port
Delay Lock Loop (DLL) for Accurate Data Placement
Supports concurrent transactions
SRAM uses rising edges only
®
II Operates with 1.5 Cycle Read Latency when Delay
DD
= 1.8V (±0.1V); I/O V
Description
DDQ
= 1.4V to V
198 Champion Court
DD
72-Mbit QDR
x18
x36
x9
Configurations
CY7C1525JV18 – 8M x 9
CY7C1512JV18 – 4M x 18
CY7C1514JV18 – 2M x 36
Functional Description
The CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 are
1.8V Synchronous Pipelined SRAMs, equipped with QDR II
architecture. QDR II architecture consists of two separate ports:
the read port and the write port to access the memory array. The
read port has dedicated data outputs to support read operations
and the write port has dedicated data inputs to support write
operations. QDR II architecture has separate data inputs and
data outputs to eliminate the need to ‘turnaround’ the data bus
that exists with common I/O devices. Access to each port is
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR II read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with two 9-bit
words (CY7C1525JV18), 18-bit words (CY7C1512JV18), or
36-bit words (CY7C1514JV18) that burst sequentially into or out
of the device. Because data is transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus ‘turnarounds’.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
267 MHz
1385
1495
1710
267
San Jose
®
II SRAM 2-Word Burst
,
CA 95134-1709
250 MHz
1255
1365
1580
250
CY7C1525JV18
CY7C1512JV18
CY7C1514JV18
Architecture
Revised August 10, 2009
408-943-2600
MHz
Unit
mA
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Related parts for CY7C1512JV18-267BZI

CY7C1512JV18-267BZI Summary of contents

Page 1

... To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with two 9-bit words (CY7C1525JV18), 18-bit words (CY7C1512JV18), or 36-bit words (CY7C1514JV18) that burst sequentially into or out of the device. Because data is transferred into and out of the ...

Page 2

... Logic Block Diagram (CY7C1525JV18 [8:0] 21 Address A (20:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [0] Logic Block Diagram (CY7C1512JV18 [17:0] 21 Address A (20:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [1:0] Document #: 001-14435 Rev. *G Write Write Address Reg Reg ...

Page 3

... Logic Block Diagram (CY7C1514JV18 [35:0] 20 Address A (19:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [3:0] Document #: 001-14435 Rev. *G Write Write Address Reg Reg Register Control Logic Read Data Reg Reg. Reg. 36 Reg. CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 20 A (19:0) RPS [35:0] Page [+] Feedback ...

Page 4

... Pin Configuration The pin configuration for CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follow DOFF V V REF DDQ TDO TCK NC/144M D10 D NC D11 Q10 Q11 F NC Q12 D12 G NC D13 Q13 H DOFF V V REF DDQ D14 Q14 L NC Q15 D15 D16 N NC D17 ...

Page 5

... Pin Configuration The pin configuration for CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follow NC/288M A B Q27 Q18 D18 C D27 Q28 D19 D D28 D20 Q19 E Q29 D29 Q20 F Q30 Q21 D21 G D30 D22 Q22 H DOFF V V REF DDQ J D31 Q31 D23 K Q32 D32 Q23 ...

Page 6

... These address inputs are multiplexed for both read and write operations. Internally, the device is organized arrays each for CY7C1525JV18 arrays each 18) for CY7C1512JV18, and arrays each 36) for CY7C1514JV18. Therefore, only 22 address inputs are needed to access the entire memory array of CY7C1525JV18, 21 address inputs for CY7C1512JV18, and 20 address inputs for CY7C1514JV18 ...

Page 7

... Ground Ground for the Device Power Supply Power Supply Inputs for the Outputs of the Device. DDQ Document #: 001-14435 Rev. *G Pin Description output impedance are set to 0.2 x RQ, where resistor connected [x:0] DDQ CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 , which enables the minimum Page [+] Feedback ...

Page 8

... This includes forwarding data from a write cycle that was initiated on the previous K clock rise. Depth Expansion The CY7C1512JV18 has a port select input for each port. This enables easy depth expansion. Both port selects are sampled on using the rising edge of the positive input clock only (K). Each port [17:0] select input can deselect the specified port ...

Page 9

... DOFF pin. When the DLL is turned off, the device behaves in QDR I mode (with one cycle latency and a longer access time). For information refer to the application note DLL Considerations in QDRII/DDRII. Figure 1. Application Example SRAM # 250ohms CQ/CQ Vddq/2 CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 SRAM # 250ohms CQ/CQ ...

Page 10

... Truth Table The truth table for CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follows. Operation Write Cycle: Load address on the rising edge of K; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K; wait one and a half cycle; read data on C and C rising edges. ...

Page 11

... No data is written into the device during this portion of a write operation. L–H No data is written into the device during this portion of a write operation. CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 ) is written into the device. [8: written into the device. [8:0] ) are written into ...

Page 12

... TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction after it is shifted in, move the TAP controller into the Update-IR state. CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 TAP Controller Block Diagram on on page 18 shows the order in which ...

Page 13

... Q-bus pins. Note that this bit is pre-set LOW to enable the output when the device is powered up, and also when the TAP controller is in the Test-Logic-Reset state. CS Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Page [+] Feedback ...

Page 14

... Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 001-14435 Rev. *G [9] 1 SELECT DR-SCAN 0 1 CAPTURE- SHIFT- EXIT1- PAUSE- EXIT2-DR 1 UPDATE- CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 1 SELECT IR-SCAN 0 1 CAPTURE- SHIFT- EXIT1- PAUSE- EXIT2-IR 1 UPDATE- Page [+] Feedback ...

Page 15

... Boundary Scan Register TAP Controller Test Conditions = −2 −100 μ 2 100 μ GND ≤ V ≤ − /2), Undershoot: V (AC) > 1.5V (Pulse width less than t CYC IL CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Selection TDO Circuitry Min Max Unit 1.4 V 1.6 V 0.4 V 0.2 V 0.65V –0.3 0.35V V DD μ ...

Page 16

... Test conditions are specified using the load in TAP AC Test Conditions. t Document #: 001-14435 Rev. *G Description [14] Figure 2. TAP Timing and Test Conditions 0.9V 1.8V 50Ω TMSH t TMSS t TDIS t TDIH t TDOV / ns CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Min Max Unit 50 20 MHz ALL INPUT PULSES 0.9V t TCYC t TDOX Page ...

Page 17

... Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Description 000 Version number. Defines the type of SRAM ...

Page 18

... Bit # Bump ID 10G 11F 58 5A 11G 10F 61 4B 11E 62 3A 10E 63 2A 10D 10C 66 3B 11D 11B 70 3C 11C 10B 73 3E 11A 74 2D 10A CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Bit # Bump 100 2P 101 1P 102 3R 103 4R 104 4P 105 5P 106 5N 107 5R 108 Internal Page [+] Feedback ...

Page 19

... SRAM behavior. To avoid this, provide1024 cycles stable clock to relock to the desired clock frequency. . REF Figure 3. Power Up Waveforms > 1024 Stable clock Stable DDQ Stable (< +/- 0.1V DC per 50ns ) / DDQ Fix High (or tie to V DDQ ) CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 . KC Var Start Normal Operation Page [+] Feedback ...

Page 20

... MHz (min) within 200 ms. During this time V < V and /2)/(RQ/5) for values of 175 ohms <= RQ <= 350 ohms. (max) = 0.95V or 0.54V , whichever is smaller. REF DDQ CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Test Description Typ Max* Unit Conditions Logical 25°C 320 368 Single-Bit Upsets Logical 25° ...

Page 21

... R = 50Ω REF OUTPUT DEVICE 0.25V 5 pF UNDER ZQ TEST RQ = 250Ω INCLUDING JIG AND (b) SCOPE /I and load capacitance shown in ( CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Min Typ Max 400 420 455 365 385 420 Min Typ Max V + 0.2 – – REF – – ...

Page 22

... An input jitter of 200 ps (t KHKH Waveforms. Transition is measured ± 100 mV from steady state voltage. AC Test Loads and and t less than t . CLZ CHZ CO CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 267 MHz 250 MHz Unit Min Max Min Max 3.75 8.4 4 ...

Page 23

... Document #: 001-14435 Rev. *G WRITE WRITE READ NOP KHKH t CYC D31 D50 D51 D60 Q00 Q01 Q20 t CLZ t CQDOH t DOH CYC t CCQO t CQOH t CCQO CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 [26, 27, 28] WRITE NOP D61 Q21 Q40 Q41 t CHZ t CQD t CQHCQH t CQH DON’T CARE UNDEFINED Page [+] Feedback ...

Page 24

... Fine Pitch Ball Grid Array ( 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array ( 1.4 mm 0.15(4X) CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 and refer to the product summary page at Operating Range Commercial Industrial BOTTOM VIEW PIN 1 CORNER Ø ...

Page 25

... Document History Page Document Title: CY7C1525JV18/CY7C1512JV18/CY7C1514JV18, 72-Mbit QDR Document Number: 001-14435 Orig. Of Submission Rev. ECN No. Change ** 1060980 VKN *A 1397384 VKN *B 1462588 VKN/AESA *C 2189567 VKN/AESA *D 2561954 VKN/PYRS *E 2612311 VKN/PYRS *F 2746930 NJY 07/31/2009 *G 2751694 VKN/AESA 08/13/2009 Document #: 001-14435 Rev. *G Description Of Change Date See ECN ...

Page 26

... QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders. psoc.cypress.com clocks.cypress.com image.cypress.com Revised August 10, 2009 CY7C1525JV18 CY7C1512JV18 CY7C1514JV18 Page [+] Feedback ...

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