CY7C1512JV18-267BZI Cypress Semiconductor Corp, CY7C1512JV18-267BZI Datasheet - Page 24

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CY7C1512JV18-267BZI

Manufacturer Part Number
CY7C1512JV18-267BZI
Description
IC SRAM 72MBIT 267MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1512JV18-267BZI

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
72M (4M x 18)
Speed
267MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1512JV18-267BZI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1512JV18-267BZIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The following table contains only
the list of parts that are currently available.
For a complete listing of all options, visit the Cypress website at
http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at
201&PageID=230.
Table 1. Ordering Information
Package Diagram
Document #: 001-14435 Rev. *G
Speed
(MHz)
250
CY7C1525JV18-250BZC
CY7C1525JV18-250BZXC
CY7C1514JV18-250BZXC
CY7C1512JV18-250BZI
Ordering Code
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
C
PIN 1 CORNER
1
http://app.cypress.com/portal/server.pt?space=CommunityPage&control=SetCommunity&CommunityID=
SEATING PLANE
2
3
4
TOP VIEW
5
or contact your local sales representative.
6
7
Figure 6. 165-Ball FBGA (15 x 17 x 1.40 mm), 51-85195
8
9
10
51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free
51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
Package
Diagram
11
www.cypress.com
A
0.15(4X)
Package Type
B
BOTTOM VIEW
11
and refer to the product summary page at
10
JEDEC REFERENCE : MO-216 / ISSUE E
PACKAGE CODE : BB0AD
NOTES :
SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.65g
9
5.00
8
15.00±0.10
7
10.00
6
Ø0.08 M C
5
Ø0.25 M C A B
Ø0.50
+0.14
-0.06
4
1.00
3
(165X)
CY7C1525JV18
CY7C1512JV18
CY7C1514JV18
2
51-85195 *B
1
PIN 1 CORNER
E
A
B
C
D
F
G
H
J
K
L
M
N
P
R
Page 24 of 26
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Range
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