ADP3211AMNR2G ON Semiconductor, ADP3211AMNR2G Datasheet

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ADP3211AMNR2G

Manufacturer Part Number
ADP3211AMNR2G
Description
IC CTLR BUCK 7BIT 2PHASE 32QFN
Manufacturer
ON Semiconductor
Datasheet

Specifications of ADP3211AMNR2G

Applications
Controller, Power Supplies for Next-Generation Intel Processors
Voltage - Input
3.3 ~ 22 V
Number Of Outputs
1
Voltage - Output
0.0125 ~ 1.5 V
Operating Temperature
-10°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
32-TFQFN Exposed Pad
Output Voltage
1.1 V
Output Current
10 A
Input Voltage
19 V
Supply Current
6 mA
Switching Frequency
400 KHz
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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ADP3211, ADP3211A
7-Bit, Programmable,
Single-Phase, Synchronous
Buck Controller
buck switching regulator controller. With its integrated driver, the
ADP3211 is optimized for converting the notebook battery voltage to
the supply voltage required by high performance Intel chipsets. An
internal 7−bit DAC is used to read a VID code directly from the
chip−set or the CPU and to set the GMCH render voltage or the CPU
core voltage to a value within the range of 0 V to 1.5 V.
programmable switching frequency that can be optimized for
efficiency depending on the output current requirement. In addition,
the ADP3211 includes a programmable load line slope function to
adjust the output voltage as a function of the load current so that the
core voltage is always optimally positioned for a load transient. The
ADP3211 also provides accurate and reliable current overload
protection and a delayed power−good output. The IC supports
On−The−Fly (OTF) output voltage changes requested by the chip−set.
applications in CPU mode. The ADP3211A has a boot voltage of
1.2 V in CPU mode.
range of −40°C to 100°C and is available in a 32−lead QFN.
Features
Applications
© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 2
The ADP3211 is a highly efficient, single−phase, synchronous
The ADP3211 uses a multi−mode architecture. It provides
The ADP3211 has a boot voltage of 1.1 V for IMVP−6.5
The ADP3211 is specified over the extended commercial temperature
Overtemperature
Light Load Operation
Additional Design Flexibility
(VID) OTF Transients
Single−Chip Solution
Input Voltage Range of 3.3 V to 22 V
±7 mV Worst−Case Differentially Sensed Core Voltage Error
Automatic Power−Saving Modes Maximize Efficiency During
Soft Transient Control Reduces Inrush Current and Audio Noise
Independent Current Limit and Load Line Setting Inputs for
Built−in Power−Good Masking Supports Voltage Identification
7−Bit, Digitally Programmable DAC with 0 V to 1.5 V Output
Short−Circuit Protection
Current Monitor Output Signal
This is a Pb−Free Device
Fully RoHS Compliant
32−Lead QFN
Notebook Power Supplies for Next Generation Intel Chipsets
Intel Netbook Atom Processors
Chipset Voltage Regulator Specifications Integrated MOSFET
Drivers
Fully Compatible with the Intel
®
IMVP−6.5t CPU and GMCH
1
PWRGD
See detailed ordering and shipping information in the package
dimensions section on page 31 of this data sheet.
CLKEN
FBRTN
COMP
IMON
GPU
ILIM
(Note: Microdot may be in either location)
FB
(A)
A
WL
YY
WW = Work Week
G
ORDERING INFORMATION
1
1
MARKING DIAGRAM
http://onsemi.com
PIN ASSIGNMENT
= ADP3211A Device Only
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
32
1
AWLYYWWG
ADP3211(A)
ADP3211A
(top view)
ADP3211
G
Publication Order Number:
CASE 488AM
MN SUFFIX
QFN32
ADP3211/D
VCC
BST
DRVH
SW
PVCC
DRVL
PGND
GND

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ADP3211AMNR2G Summary of contents

Page 1

ADP3211, ADP3211A 7-Bit, Programmable, Single-Phase, Synchronous Buck Controller The ADP3211 is a highly efficient, single−phase, synchronous buck switching regulator controller. With its integrated driver, the ADP3211 is optimized for converting the notebook battery voltage to the supply voltage required by ...

Page 2

GND VCC EN UVLO Shutdown and Bias COMP VEA FB − REF + + CSREF LLINE 1.55V DAC + 200mV − + CSREF − + DAC − 300 mV PWRGD Startup PWRGD Delay Open PWRGD ...

Page 3

ABSOLUTE MAXIMUM RATINGS Parameter V CC FBRTN, PGND BST, DRVH DC t < 200 ns BST < 200 ns BST < 200 ns DRVH to SW DRVL to PGND DC ...

Page 4

PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic 1 PWRGD Power−Good Output. Open−drain output. A low logic state means that the output voltage is outside of the VID DAC defined range. 2 IMON Current Monitor Output. This pin sources current proportional to ...

Page 5

ELECTRICAL CHARACTERISTICS ( −40°C to 100°C, unless otherwise noted. (Note 1) Current entering a pin (sunk by the device) has a positive sign. A Parameter Symbol VOLTAGE CONTROL − Voltage Error Amplifier (VEAMP) FB, LLINE Voltage Range V ...

Page 6

ELECTRICAL CHARACTERISTICS ( −40°C to 100°C, unless otherwise noted. (Note 1) Current entering a pin (sunk by the device) has a positive sign. A Parameter Symbol VOLTAGE MONITORING and PROTECTION − Power Good PWRGD Low Voltage V PWRGD ...

Page 7

ELECTRICAL CHARACTERISTICS ( −40°C to 100°C, unless otherwise noted. (Note 1) Current entering a pin (sunk by the device) has a positive sign. A Parameter Symbol PULSE WIDTH MODULATOR − Clock Oscillator R Voltage PWM ...

Page 8

ELECTRICAL CHARACTERISTICS ( −40°C to 100°C, unless otherwise noted. (Note 1) Current entering a pin (sunk by the device) has a positive sign. A Parameter Symbol HIGH−SIDE MOSFET DRIVER Pullup Resistance, Sourcing Current Pulldown Resistance, Sinking Current Transition ...

Page 9

TYPICAL PERFORMANCE CHARACTERISTICS V VID Output Voltage 1 VID5 Switch 2 Node 3 1: 200mV/div 3 : 10V/div 2: 2V/div Input = 12V, 1A Load VID Step 0.7V to 1.2V Figure 3. VID Change Soft Transient 300 250 S W ...

Page 10

TYPICAL PERFORMANCE CHARACTERISTICS Output Voltage 0.5V/div 3: 5V/div 2ms/div GPU = 0V 4: 5V/div 2: 5V/div Figure 9. Startup Waveforms CPU Mode Output Voltage 1 Switch Node Low Side Gate Drive ...

Page 11

TYPICAL PERFORMANCE CHARACTERISTICS Output Voltage 1 Switch Node 2 Input = 12V 40 ms/div 1: 50mV/div Output = 1.2V 2: 10V/div 15A to 3A Step Figure 15. Load Transient Output Voltage 1 Switch Node 2 200 ms/div Input = 12V ...

Page 12

Theory of Operation The ADP3211 is a Ramp Pulse Modulated (RPM) controller for synchronous buck Intel GMCH and CPU core power supply. The internal 7−bit VID DAC conforms to the Intel IMVP−6.5 specifications. The ADP3211 is a stable, high performance ...

Page 13

CLOCK RAMP OSCILLATOR 0.2 V VCC RAMP COMP Setting Switch Frequency Master Clock Frequency in PWM Mode When the ADP3211 runs in PWM, the clock frequency ...

Page 14

MOSFET. The current sense amplifier can be configured several ways, depending on system optimization objectives, and the current information can be obtained by: • Output inductor ESR sensing without the use of a ...

Page 15

GPU = 0 V Figure 22. ADP3211 Powerup Sequence for CPU V5_S EN V CCGFX PGDELAY PWRGD GPU = 5.0 V Figure 23. Powerup Sequence for GPU VID Change and Soft Transient With GPU connected to 5.0 V for GPU ...

Page 16

Output Voltage 0.5 V/div SWITCH NODE 10 V/div PWRGD 5.0 V/div 2.0 V/div CLKEN 2 ms/div CURRENT LIMIT LATCHED APPLIED Figure 24. Current Overload The latchoff function can be reset either by removing and reapplying briefly pulling ...

Page 17

Inductor Current Switch Node Voltage Figure 30. Inductor Current and Switch Node in DCM LOW SIDE GATE 5V/div SWITCH NODE 5.0 V/div CSREF to CSCOMP 50mV/div 4 ms/div Figure 31. Single−Phase Waveforms in ...

Page 18

Overlay Protection Circuit The overlap protection circuit prevents both main power switches, the high side MOSFET Q1 and the low side MOSFET Q2, from being on at the same time. This is done to prevent shoot−through currents from flowing through ...

Page 19

Table 1. VID Code Table VID6 VID5 VID4 ...

Page 20

Table 1. VID Code Table VID6 VID5 VID4 ...

Page 21

PWRGD IREF EN RPM VID0 R14 200 kΩ RT VID1 R15 340 kΩ RAMP VID2 LLINE VID3 R24 DNP CSREF VID4 CSFB VID5 CSCOMP VID6 Figure 33. Typical Application Circuit http://onsemi.com 21 V3.3V VR_ON VID0 VID1 VID2 VID3 VID4 VID5 ...

Page 22

Application Information The ADP3211 application circuit should be fine−tuned in the final design. The equations in the Application Information section are used as a starting point for a new design. The design parameters for a typical IMVP−6.5− compliant GPU core ...

Page 23

VID MIN VID O MIN RIPPLE In this example assumed to be the ESR of the ...

Page 24

Place as close as possible to nearest inductor ADP3211 CSCOMP CSFB − CSREF + Figure 34. Temperature−Compensation Circuit Values The following procedure and expressions yield values for and R (the thermistor value at 25°C) for CS1 ...

Page 25

C X(MIN) C X(MAX) To meet the conditions of these expressions and the transient response, the ESR of the bulk capacitor bank (R should be less than two times the droop resistance, R the C is greater than C X(MIN) ...

Page 26

R DS(SF) be less than 13 room temperature high temperature. Another important factor for the synchronous MOSFET is the input capacitance and feedback capacitance. The ratio of the feedback to ...

Page 27

MOSFET turns on. The switch node ringing could cause EMI system failures and increased stress on the power components and controller. The RC snubber should be placed as close as possible to the low side ...

Page 28

The expressions that follow compute the time constants for the poles and zeros in the system and are intended to yield an optimal starting point for the design; some adjustments may be necessary to account for PCB and component parasitic ...

Page 29

Measure the output ripple with no load and with a full load with scope, making sure both are within the specifications. Set the AC Load Line 1. Remove the dc load from the circuit and connect a dynamic load. ...

Page 30

V TRANREL V DROOP Figure 39. Transient Setting Waveform, Load Release Layout and Component Placement The following guidelines are recommended for optimal performance of a switching regulator system. General Recommendations 1. For best results, use a PCB ...

Page 31

... Device Number* Temperature Range ADP3211MNR2G −40°C to 100°C ADP3211AMNR2G −40°C to 100°C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *The “G’’ suffix indicates Pb−Free package. ...

Page 32

... X e 0.63 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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